NVIDIA GA10B 32SM vs Intel Iris Xe 80EU 1400MHz Full Specs

Summary

2,048 Shaders 1.3GHz	640 Shaders 1.4GHz
Shared Memory204.8GB/sLPDDR5	Shared Memory102.4GB/s LPDDR5X·DDR5·LPDDR5·LPDDR4X·DDR4
Peak·FP32·FP16 5.33 TFLOPS	Peak·FP32·FP16 1.79 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1300MHz UC·Boost·OC	Clock Speed1400MHz UC·Boost·OC
Peak OPS 340.8 TOPSINT4 Tensor Sparse	Peak OPS 3.58 TFLOPSFP16
Tensor FP16-16 42.6 TFLOPS FP16-16 Tensor Sparse 85.2 TFLOPS Tensor FP16-32 42.6 TFLOPS FP16-32 Tensor Sparse 85.2 TFLOPS	-
Tensor BF16 42.6 TFLOPS BF16 Tensor Sparse 85.2 TFLOPS	-
Tensor TF32 21.3 TFLOPS	Tensor TF32 -
FP32 5.33 TFLOPS	FP32 1.79 TFLOPS
-	FP64 448 GFLOPS
Tensor INT4 170.4 TOPS	Tensor INT4 -
Tensor INT8 85.2 TOPS	-
Pixel Rate 41.6 GPixel/s	Pixel Rate 28 GPixel/s
Texture Rate 20.8 GTexel/s	Texture Rate 56 GTexel/s

Core Config

Shaders 2,048 Shaders	Shaders 640 Shaders
TMUs 16 TMUs	TMUs 40 TMUs
ROPs 32 ROPs	ROPs 20 ROPs
Tensor Cores 64 T-Cores	Tensor Cores -
SMs 16 SMs	EUs 80 EUs

Clocks

Boost Clock 1.3GHz

Boost Clock 1.4GHz

Cache

L2 Cache 4MB shared	L2 Cache 896KB shared
L3 Cache -	L3 Cache 3MB shared

Memory

Shared MemoryLPDDR5	Shared Memory LPDDR5X·DDR5·LPDDR5·LPDDR4X·DDR4
Memory Bus 256-bit	Memory Bus 128-bit
Memory Speed 6.4GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 204.8GB/s	Memory Bandwidth 102.4GB/s
ECC No	ECC No

Video Output

Multi-Monitor -

Multi-Monitor 4

Encoder

Encoder Model NVENC 7	Encoder Model Quick Sync Video 8
Codec - - AVC (H.264) HEVC (H.265) -	Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Model NVDEC 5	Decoder Model Quick Sync Video 8
Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Ampere	Architecture Gen 12
Family Jetson	Family Gen 12
Branding	Branding
Codename Hercules	Codename Xe LP
Chip Variant -	Chip Variant GT1
Market Segment Embedded	Market Segment Laptop
Release Date Jan 1, 2021	Release Date Jan 18, 2022

Fabrication

Foundry Samsung	Foundry Intel
Fabrication Node 8N	Fabrication Node Intel 7
Die Size -	Die Size 208mm²
Transistor Count 17 Billion	Transistor Count 15.2 Billion
Transistor Density -	Transistor Density 73 MTr/mm²

Images