NVIDIA GeForce MX150 10W vs Intel Graphics 2C 2300MHz Full Specs

Summary

384 Shaders 1.04GHz	256 Shaders 2.3GHz
2GB GDDR540GB/s placeholder	Shared Memory119.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 797.2 GFLOPS	Peak·FP32·FP16 1.18 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 10W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

GeForce MX150 10W797.2 GFLOPSFP32

x1

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x47.27

Show Top Score

Theoretical Performance

Clock Speed1038MHz UC·Base·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 797.2 GFLOPSFP32	Peak OPS 37.68 TOPSINT4 Tensor
-	Tensor FP16-32 9.42 TFLOPS
-	Tensor BF16 9.42 TFLOPS
FP32 797.2 GFLOPS	FP32 1.18 TFLOPS
FP64 24.91 GFLOPS	FP64 294.4 GFLOPS
Tensor INT4 -	Tensor INT4 37.68 TOPS
-	Tensor INT8 18.84 TOPS
Pixel Rate 16.6 GPixel/s	Pixel Rate 18.4 GPixel/s
Texture Rate 24.9 GTexel/s	Texture Rate 36.8 GTexel/s

Core Config

Shaders 384 Shaders	Shaders 256 Shaders
TMUs 24 TMUs	TMUs 16 TMUs
ROPs 16 ROPs	ROPs 8 ROPs
Tensor Cores -	Tensor Cores 16 T-Cores
RT Cores -	RT Cores 2 RT-Cores
SMs 3 SMs	EUs 16 EUs

Clocks

Base Clock 937MHz	Base Clock -
Boost Clock 1.04GHz	Boost Clock 2.3GHz

Cache

L2 Cache 512KB shared

L2 Cache 4.1MB shared

Memory

2GB GDDR5 placeholder	Shared Memory LPDDR5X·DDR5
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 5GT/s	Memory Speed 7.5GT/s
Memory Bandwidth 40GB/s	Memory Bandwidth 119.5GB/s

Power & Thermals

TDP 10W

TDP Shared

Video Output

Multi-Monitor 2	Multi-Monitor 3
HDCP HDCP 2.2	HDCP -

Encoder

-	Encoder Model Xe Media Engine

Decoder

Decoder Model NVDEC 3

Decoder Model Xe Media Engine

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Pascal	Architecture Battlemage
Family GeForce MX	Family Gen 13
Branding	Branding
Codename NV138	Codename Xe3 LPG
Chip Variant GP108-200-A1	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date May 17, 2017	Release Date Jan 5, 2026

Fabrication

Foundry Samsung	Foundry Intel
Fabrication Node 14LPP	Fabrication Node Intel 3
Die Size 74mm²	Die Size 27mm²
Transistor Count 1.8 Billion	Transistor Count -
Transistor Density 24.32 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

CPUs -

CPUs Core Ultra 5 322 Core Ultra 5 332

Competitors

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