NVIDIA GeForce MX450 GDDR5 vs Intel Graphics 4C 2450MHz Full Specs

Summary

896 Shaders 1.57GHz	512 Shaders 2.45GHz
2GB GDDR564GB/s placeholder	Shared Memory136.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 2.82 TFLOPS	Peak·FP32·FP16 2.51 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 31W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

GeForce MX450 GDDR55.64 TFLOPSFP16

x1

Graphics 4C 2450MHz80.28 TOPSINT4 Tensor

x14.22

Show Top Score

Theoretical Performance

Clock Speed1575MHz UC·Base·Boost·OC	Clock Speed2450MHz UC·Boost·OC
Peak OPS 5.64 TFLOPSFP16	Peak OPS 80.28 TOPSINT4 Tensor
-	Tensor FP16-32 20.07 TFLOPS
-	Tensor BF16 20.07 TFLOPS
FP32 2.82 TFLOPS	FP32 2.51 TFLOPS
FP64 88.2 GFLOPS	FP64 627.2 GFLOPS
Tensor INT4 -	Tensor INT4 80.28 TOPS
-	Tensor INT8 40.14 TOPS
Pixel Rate 50.4 GPixel/s	Pixel Rate 39.2 GPixel/s
Texture Rate 88.2 GTexel/s	Texture Rate 78.4 GTexel/s

Core Config

Shaders 896 Shaders	Shaders 512 Shaders
TMUs 56 TMUs	TMUs 32 TMUs
ROPs 32 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
RT Cores -	RT Cores 4 RT-Cores
SMs 14 SMs	EUs 32 EUs

Clocks

Base Clock 1.4GHz	Base Clock -
Boost Clock 1.57GHz	Boost Clock 2.45GHz

Cache

L2 Cache 1MB shared

L2 Cache 4.1MB shared

Memory

2GB GDDR5 placeholder	Shared Memory LPDDR5X·DDR5
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 8GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 64GB/s	Memory Bandwidth 136.5GB/s

Power & Thermals

TDP 31W

TDP Shared

Video Output

Multi-Monitor 2	Multi-Monitor 3
HDCP HDCP 2.2	HDCP -

Encoder

-	Encoder Model Xe Media Engine

Decoder

-	Decoder Model Xe Media Engine

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Turing	Architecture Battlemage
Family GeForce MX	Family Gen 13
Branding	Branding
Codename NV167	Codename Xe3 LPG
Chip Variant TU117-150-A1	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Aug 1, 2020	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node 12FFN	Fabrication Node Intel 3
Die Size 200mm²	Die Size 27mm²
Transistor Count 4.7 Billion	Transistor Count -
Transistor Density 23.5 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

CPUs -	CPUs Core Ultra 5 325 Core Ultra 5 335 Core Ultra 7 356H
Laptops Notebook Plus2(Early 2021)Galaxy Book Flex2 15(Late 2020)Galaxy Book Ion2 15(Late 2020)	Laptops -

Competitors

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