NVIDIA GeForce RTX 3050 Laptop 80W vs Intel Arc A370M Full Specs
2,048 Shaders 1.74GHz | 1,024 Shaders 1.55GHz |
4GB GDDR6192GB/s | 4GB GDDR6112GB/s |
·· 7.13 TFLOPS | ·· 3.17 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 80W | TDP 35W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 228.1 TOPSINT4 Tensor Sparse | Peak OPS 101.6 TOPSINT4 Tensor |
FP16 7.13 TFLOPSTensor FP16-16 28.51 TFLOPSFP16-16 Tensor Sparse 57.02 TFLOPSTensor FP16-32 14.25 TFLOPSFP16-32 Tensor Sparse 28.51 TFLOPS | FP16 6.35 TFLOPSTensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 25.4 TFLOPSFP16-32 Tensor Sparse - |
BF16 7.13 TFLOPSTensor BF16 14.25 TFLOPSBF16 Tensor Sparse 28.51 TFLOPS | BF16 -Tensor BF16 25.4 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 7.13 TFLOPS | Tensor TF32 - |
FP32 7.13 TFLOPS | FP32 3.17 TFLOPS |
FP64 111.4 GFLOPS | FP64 793.6 GFLOPS |
Tensor INT4 114 TOPS | Tensor INT4 101.6 TOPS |
Tensor INT8 57.02 TOPS | Tensor INT8 50.79 TOPS |
Ray 10.75 TOPS | Ray - |
Pixel Rate 55.7 GPixel/s | Pixel Rate 49.6 GPixel/s |
Texture Rate 111.4 GTexel/s | Texture Rate 99.2 GTexel/s |
Shaders 2,048 Shaders | Shaders 1,024 Shaders |
TMUs 64 TMUs | TMUs 64 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores 128 T-Cores |
RT Cores 16 RT-Cores | RT Cores 8 RT-Cores |
SMs 16 SMs | EUs 128 EUs |
Base Clock 1.49GHz | Base Clock 300MHz |
Boost Clock 1.74GHz | Boost Clock 1.55GHz |
L1 64KB/SM Tex | L1 192KB/Xe-core |
L2 Cache 2MB shared | L2 Cache 4MB shared |
4GB GDDR6 | 4GB GDDR6 |
Memory Bus 128-bit | Memory Bus 64-bit |
Memory Speed 12GT/s | Memory Speed 14GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 112GB/s |
ECC No | ECC No |
TDP 80W | TDP 35W |
Max Resolution 7680x4320 | Max Resolution 7680x4320 |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz |
Multi-Monitor 3 | Multi-Monitor 4 |
Adaptive Sync G-Sync FreeSync | Adaptive Sync - FreeSync |
DSC Supported | DSC - |
HDCP HDCP 2.3 | HDCP - |
Shader Model 6.6 | Shader Model 6.6 |
DirectX DirectX 12Direct3D 12_2 | DirectX DirectX 12Direct3D 12_2 |
OpenGL 4.6OpenCL 3Vulkan 1.2 | OpenGL 4.6OpenCL 3Vulkan 1.3 |
CUDA 8.6PureVideo HD VP11VDPAU Feature Set K | - |
Encoder NVENC 7 | Encoder Arc |
Codec - - AVC (H.264) HEVC (H.265) - | Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1 |
Decoder NVDEC 5 | Decoder Arc |
Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 | Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
PCIe PCIe 4.0 x8 | PCIe PCIe 4.0 x8 |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename Xe HPG |
Chip Variant GA107-140-A1 | Chip Variant DG2-128 |
Market Segment Laptop | Market Segment Laptop |
Release Date May 11, 2021 | Release Date Mar 30, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 200mm² | Die Size 157mm² |
Transistor Count 8.7B | Transistor Count 7.2B |
Transistor Density 43.5 MTr/mm² | Transistor Density 45.86 MTr/mm² |





