NVIDIA GeForce RTX 3050 Ti Laptop 40W vs Qualcomm Adreno X2-90 7.6T Full Specs
2,560 Shaders 1.19GHz | 2,048 Shaders 1.85GHz |
4GB GDDR6192GB/s placeholder | Shared Memory228.6GB/sLPDDR5X |
·· 6.07 TFLOPS | ·· 7.58 TFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 40W | TDP 15W |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 194.2 TOPSINT4 Tensor Sparse | Peak OPS 15.16 TFLOPSFP16 |
Tensor FP16-16 24.27 TFLOPSFP16-16 Tensor Sparse 48.54 TFLOPSTensor FP16-32 12.13 TFLOPSFP16-32 Tensor Sparse 24.27 TFLOPS | - |
BF16 6.07 TFLOPSTensor BF16 12.13 TFLOPSBF16 Tensor Sparse 24.27 TFLOPS | BF16 15.16 TFLOPSTensor BF16 -BF16 Tensor Sparse - |
Tensor TF32 6.07 TFLOPS | Tensor TF32 - |
FP32 6.07 TFLOPS | FP32 7.58 TFLOPS |
FP64 94.8 GFLOPS | FP64 1.89 TFLOPS |
Tensor INT4 97.08 TOPS | Tensor INT4 - |
Tensor INT8 48.54 TOPS | - |
Ray 9.15 TOPS | Ray - |
Pixel Rate 37.9 GPixel/s | Pixel Rate 118.4 GPixel/s |
Texture Rate 94.8 GTexel/s | Texture Rate 236.8 GTexel/s |
Shaders 2,560 Shaders | Shaders 2,048 Shaders |
TMUs 80 TMUs | TMUs 128 TMUs |
ROPs 32 ROPs | ROPs 64 ROPs |
Tensor Cores 80 T-Cores | Tensor Cores - |
RT Cores 20 RT-Cores | RT Cores - |
SMs 20 SMs | EUs 16 EUs |
Base Clock 915MHz | Base Clock - |
Boost Clock 1.19GHz | Boost Clock 1.85GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 21MB shared |
4GB GDDR6 placeholder | Shared MemoryLPDDR5X |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 12GT/s | Memory Speed 9.5GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 228.6GB/s |
TDP 40W | TDP 15W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP - |
Encoder Model NVENC 7 | Encoder Model Hexagon AV1 |
Decoder Model NVDEC 5 | Decoder Model Hexagon AV1 |
Form Factor Soldered | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename - |
Chip Variant GA107-140-A1 | Chip Variant - |
Market Segment Laptop | Market Segment Laptop |
Release Date May 11, 2021 | Release Date Sep 24, 2025 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N3E |
Die Size 200mm² | Die Size 288mm² |
Transistor Count 8.7 Billion | Transistor Count - |
Transistor Density 43.5 MTr/mm² | Transistor Density - |
No images available
No images available
CPUs - | CPUs |
Laptops | Laptops - |



