NVIDIA GeForce RTX 3050 Ti Laptop 80W vs Apple 10-Core M3 Full Specs
2,560 Shaders 1.7GHz | 1,280 Shaders 1.34GHz |
4GB GDDR6192GB/s placeholder | Shared Memory102.4GB/sLPDDR5 |
·· 8.68 TFLOPS | ·· 3.42 TFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 80W | TDP Shared |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 277.7 TOPSINT4 Tensor Sparse | Peak OPS 3.42 TFLOPSFP16 |
Tensor FP16-16 34.71 TFLOPSFP16-16 Tensor Sparse 69.43 TFLOPSTensor FP16-32 17.36 TFLOPSFP16-32 Tensor Sparse 34.71 TFLOPS | - |
BF16 8.68 TFLOPSTensor BF16 17.36 TFLOPSBF16 Tensor Sparse 34.71 TFLOPS | - |
Tensor TF32 8.68 TFLOPS | Tensor TF32 - |
FP32 8.68 TFLOPS | FP32 3.42 TFLOPS |
FP64 135.6 GFLOPS | - |
Tensor INT4 138.9 TOPS | Tensor INT4 - |
Tensor INT8 69.43 TOPS | - |
Ray 13.09 TOPS | Ray - |
Pixel Rate 54.2 GPixel/s | Pixel Rate 53.5 GPixel/s |
Texture Rate 135.6 GTexel/s | Texture Rate 107 GTexel/s |
Shaders 2,560 Shaders | Shaders 1,280 Shaders |
TMUs 80 TMUs | TMUs 80 TMUs |
ROPs 32 ROPs | ROPs 40 ROPs |
Tensor Cores 80 T-Cores | Tensor Cores - |
RT Cores 20 RT-Cores | RT Cores 10 RT-Cores |
SMs 20 SMs | EUs 160 EUs |
Base Clock 1.46GHz | Base Clock - |
Boost Clock 1.7GHz | Boost Clock 1.34GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
4GB GDDR6 placeholder | Shared MemoryLPDDR5 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 12GT/s | Memory Speed 6.4GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 102.4GB/s |
ECC No | ECC No |
TDP 80W | TDP Shared |
Multi-Monitor 3 | Multi-Monitor 1 |
HDCP HDCP 2.3 | HDCP - |
Encoder Model NVENC 7 | Encoder Model Apple Media Engine 3 |
Decoder Model NVDEC 5 | Decoder Model Apple Media Engine 3 |
Form Factor Soldered | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename G15G |
Chip Variant GA107-140-A1 | Chip Variant - |
Market Segment Laptop | Market Segment Laptop |
Release Date May 11, 2021 | Release Date Oct 30, 2023 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N3B |
Die Size 200mm² | Die Size 153mm² |
Transistor Count 8.7 Billion | Transistor Count 25 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 164 MTr/mm² |
No images available
No images available
CPUs - | CPUs |
Laptops | Laptops |
All-in-Ones - | All-in-Ones |



