NVIDIA GeForce RTX 3050 vs Apple 60-Core M2 Ultra Full Specs
2,560 Shaders 1.78GHz | 7,680 Shaders 1.4GHz |
8GB GDDR6224GB/s placeholder | Shared Memory819.2GB/sLPDDR5 |
·· 9.1 TFLOPS | ·· 21.47 TFLOPS |
Form Factor PCIe Card | Form Factor iGPU |
TDP 115W | TDP Shared |
Power Connectors 1x 12-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 291.1 TOPSINT4 Tensor Sparse | Peak OPS 21.47 TFLOPSFP16 |
Tensor FP16-16 36.39 TFLOPSFP16-16 Tensor Sparse 72.79 TFLOPSTensor FP16-32 18.2 TFLOPSFP16-32 Tensor Sparse 36.39 TFLOPS | - |
BF16 9.1 TFLOPSTensor BF16 18.2 TFLOPSBF16 Tensor Sparse 36.39 TFLOPS | - |
Tensor TF32 9.1 TFLOPS | Tensor TF32 - |
FP32 9.1 TFLOPS | FP32 21.47 TFLOPS |
FP64 142.2 GFLOPS | - |
Tensor INT4 145.6 TOPS | Tensor INT4 - |
Tensor INT8 72.79 TOPS | - |
Ray 13.72 TOPS | Ray - |
Pixel Rate 56.9 GPixel/s | Pixel Rate 335.5 GPixel/s |
Texture Rate 142.2 GTexel/s | Texture Rate 671 GTexel/s |
Shaders 2,560 Shaders | Shaders 7,680 Shaders |
TMUs 80 TMUs | TMUs 480 TMUs |
ROPs 32 ROPs | ROPs 240 ROPs |
Tensor Cores 80 T-Cores | Tensor Cores - |
RT Cores 20 RT-Cores | RT Cores - |
SMs 20 SMs | EUs 960 EUs |
Base Clock 1.55GHz | Base Clock - |
Boost Clock 1.78GHz | Boost Clock 1.4GHz |
L2 Cache 2MB shared | L2 Cache 16.4MB shared |
8GB GDDR6 placeholder | Shared MemoryLPDDR5 |
Memory Bus 128-bit | Memory Bus 1024-bit |
Memory Speed 14GT/s | Memory Speed 6.4GT/s |
Memory Bandwidth 224GB/s | Memory Bandwidth 819.2GB/s |
ECC No | ECC No |
TDP 115W | TDP Shared |
Multi-Monitor 3 | Multi-Monitor 8 |
HDCP HDCP 2.3 | HDCP - |
3x DisplayPort 1.4 | - |
1x HDMI 2.1 | - |
Encoder Model NVENC 7 | Encoder Model 4x Apple Media Engine 2 |
Decoder Model NVDEC 5 | Decoder Model 2x Apple Media Engine 2 |
Form Factor PCIe Card | Form Factor iGPU |
PCIe 1.9-Slots | PCIe - |
Height 112 mm (4.41")Width 242 mm (9.53")Depth 38 mm (1.5") | - |
Cooling Open-Air 2x Fans | Cooling Passive - |
Power Connectors 1x 12-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename G14D |
Chip Variant GA107-140-A1 | Chip Variant - |
Market Segment Desktop | Market Segment Workstation |
Release Date Dec 16, 2022 | Release Date Jun 5, 2023 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N5P |
Die Size 200mm² | Die Size 971mm² |
Transistor Count 8.7 Billion | Transistor Count 134 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 138 MTr/mm² |
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