GPUs

NVIDIA GeForce RTX 3050 vs Apple 60-Core M2 Ultra Full Specs

2,560 Shaders
1.78GHz
7,680 Shaders
1.4GHz
8GB GDDR6224GB/s
Shared Memory819.2GB/sLPDDR5
··
9.1 TFLOPS
··
21.47 TFLOPS
Form Factor
PCIe Card
Form Factor
iGPU
TDP
115W
TDP
Shared
Power Connectors
1x 12-Pin
Power Connectors
-

GeForce RTX 3050GeForce RTX 3050291.1 TOPSINT4 Tensor Sparse
x13.56
60-Core M2 Ultra60-Core M2 Ultra21.47 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
··
Peak OPS
291.1 TOPSINT4 Tensor Sparse
Peak OPS
21.47 TFLOPSFP16
Tensor FP16-16
36.39 TFLOPS
FP16-16 Tensor Sparse
72.79 TFLOPS
Tensor FP16-32
18.2 TFLOPS
FP16-32 Tensor Sparse
36.39 TFLOPS
-
BF16
9.1 TFLOPS
Tensor BF16
18.2 TFLOPS
BF16 Tensor Sparse
36.39 TFLOPS
-
Tensor TF32
9.1 TFLOPS
Tensor TF32
-
FP32
9.1 TFLOPS
FP32
21.47 TFLOPS
FP64
142.2 GFLOPS
-
Tensor INT4
145.6 TOPS
Tensor INT4
-
Tensor INT8
72.79 TOPS
-
Ray
13.72 TOPS
Ray
-
Pixel Rate
56.9 GPixel/s
Pixel Rate
335.5 GPixel/s
Texture Rate
142.2 GTexel/s
Texture Rate
671 GTexel/s

Shaders
2,560 Shaders
Shaders
7,680 Shaders
TMUs
80 TMUs
TMUs
480 TMUs
ROPs
32 ROPs
ROPs
240 ROPs
Tensor Cores
80 T-Cores
Tensor Cores
-
RT Cores
20 RT-Cores
RT Cores
-
SMs
20 SMs
EUs
960 EUs

Base Clock
1.55GHz
Base Clock
-
Boost Clock
1.78GHz
Boost Clock
1.4GHz

L2 Cache
2MB shared
L2 Cache
16.4MB shared

8GB GDDR6
Shared MemoryLPDDR5
Memory Bus
128-bit
Memory Bus
1024-bit
Memory Speed
14GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
224GB/s
Memory Bandwidth
819.2GB/s
ECC
No
ECC
No

TDP
115W
TDP
Shared

Multi-Monitor
3
Multi-Monitor
8
HDCP
HDCP 2.3
HDCP
-

3x DisplayPort 1.4
-
1x HDMI 2.1
-

Encoder Model
NVENC 7
Encoder Model
4x Apple Media Engine 2

Decoder Model
NVDEC 5
Decoder Model
2x Apple Media Engine 2

Form Factor
PCIe Card
Form Factor
iGPU
PCIe
1.9-Slots
PCIe
-
Height
112 mm (4.41")
Width
242 mm (9.53")
Depth
38 mm (1.5")
-
Cooling
Open-Air
2x Fans
Cooling
Passive
-
Power Connectors
1x 12-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
M2 Ultra branding
Codename
NV177
Codename
G14D
Chip Variant
GA107-140-A1
Chip Variant
-
Market Segment
Desktop
Market Segment
Workstation
Release Date
Dec 16, 2022
Release Date
Jun 5, 2023

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
N5P
Die Size
200mm²
Die Size
971mm²
Transistor Count
8.7 Billion
Transistor Count
134 Billion
Transistor Density
43.5 MTr/mm²
Transistor Density
138 MTr/mm²

No images available
No images available