NVIDIA GeForce RTX 3060 Laptop 95W vs Intel Arc A370M Full Specs
3,840 Shaders 1.57GHz | 1,024 Shaders 1.55GHz |
6GB GDDR6336GB/s | 4GB GDDR6112GB/s |
·· 12.03 TFLOPS | ·· 3.17 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 95W | TDP 35W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 385.1 TOPSINT4 Tensor Sparse | Peak OPS 101.6 TOPSINT4 Tensor |
Tensor FP16-16 48.14 TFLOPSFP16-16 Tensor Sparse 96.28 TFLOPSTensor FP16-32 24.07 TFLOPSFP16-32 Tensor Sparse 48.14 TFLOPS | Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 25.4 TFLOPSFP16-32 Tensor Sparse - |
BF16 12.03 TFLOPSTensor BF16 24.07 TFLOPSBF16 Tensor Sparse 48.14 TFLOPS | BF16 -Tensor BF16 25.4 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 12.03 TFLOPS | Tensor TF32 - |
FP32 12.03 TFLOPS | FP32 3.17 TFLOPS |
FP64 188 GFLOPS | FP64 793.6 GFLOPS |
Tensor INT4 192.6 TOPS | Tensor INT4 101.6 TOPS |
Tensor INT8 96.28 TOPS | Tensor INT8 50.79 TOPS |
Ray 18.15 TOPS | Ray - |
Pixel Rate 75.2 GPixel/s | Pixel Rate 49.6 GPixel/s |
Texture Rate 188 GTexel/s | Texture Rate 99.2 GTexel/s |
Shaders 3,840 Shaders | Shaders 1,024 Shaders |
TMUs 120 TMUs | TMUs 64 TMUs |
ROPs 48 ROPs | ROPs 32 ROPs |
Tensor Cores 120 T-Cores | Tensor Cores 128 T-Cores |
RT Cores 30 RT-Cores | RT Cores 8 RT-Cores |
SMs 30 SMs | EUs 128 EUs |
Base Clock 1.22GHz | Base Clock 300MHz |
Boost Clock 1.57GHz | Boost Clock 1.55GHz |
L2 Cache 3MB shared | L2 Cache 4MB shared |
6GB GDDR6 | 4GB GDDR6 |
Memory Bus 192-bit | Memory Bus 64-bit |
Memory Speed 14GT/s | Memory Speed 14GT/s |
Memory Bandwidth 336GB/s | Memory Bandwidth 112GB/s |
ECC No | ECC No |
TDP 95W | TDP 35W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
Encoder Model NVENC 7 | Encoder Model Arc |
Codec AVC (H.264) HEVC (H.265) - | Codec AVC (H.264) HEVC (H.265) AV1 |
Decoder Model NVDEC 5 | Decoder Model Arc |
Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 | Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV176 | Codename Xe HPG |
Chip Variant GA106-150-KA-A1 | Chip Variant DG2-128 |
Market Segment Laptop | Market Segment Laptop |
Release Date Feb 25, 2021 | Release Date Mar 30, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 276mm² | Die Size 157mm² |
Transistor Count 13.3 Billion | Transistor Count 7.2 Billion |
Transistor Density 48.01 MTr/mm² | Transistor Density 45.86 MTr/mm² |

