NVIDIA GeForce RTX 3070 Ti Laptop 125W vs Intel UHD 16EU 1450MHz Gen 12 Full Specs
5,888 Shaders 1.49GHz | 128 Shaders 1.45GHz |
8GB GDDR6448GB/s placeholder | Shared Memory76.8GB/s · |
·· 17.49 TFLOPS | ·· 371.2 GFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 125W | TDP Shared |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 559.6 TOPSINT4 Tensor Sparse | Peak OPS 742.4 GFLOPSFP16 |
Tensor FP16-16 69.95 TFLOPSFP16-16 Tensor Sparse 139.9 TFLOPSTensor FP16-32 34.97 TFLOPSFP16-32 Tensor Sparse 69.95 TFLOPS | - |
BF16 17.49 TFLOPSTensor BF16 34.97 TFLOPSBF16 Tensor Sparse 69.95 TFLOPS | - |
Tensor TF32 17.49 TFLOPS | Tensor TF32 - |
FP32 17.49 TFLOPS | FP32 371.2 GFLOPS |
FP64 273.2 GFLOPS | FP64 92.8 GFLOPS |
Tensor INT4 279.8 TOPS | Tensor INT4 - |
Tensor INT8 139.9 TOPS | - |
Ray 26.37 TOPS | Ray - |
Pixel Rate 142.6 GPixel/s | Pixel Rate 11.6 GPixel/s |
Texture Rate 273.2 GTexel/s | Texture Rate 11.6 GTexel/s |
Shaders 5,888 Shaders | Shaders 128 Shaders |
TMUs 184 TMUs | TMUs 8 TMUs |
ROPs 96 ROPs | ROPs 8 ROPs |
Tensor Cores 184 T-Cores | Tensor Cores - |
RT Cores 46 RT-Cores | RT Cores - |
SMs 46 SMs | EUs 16 EUs |
Base Clock 1.03GHz | Base Clock - |
Boost Clock 1.49GHz | Boost Clock 1.45GHz |
L2 Cache 4.1MB shared | L2 Cache 224KB shared |
L3 Cache - | L3 Cache 1MB shared |
8GB GDDR6 placeholder | Shared Memory · |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 4.8GT/s |
Memory Bandwidth 448GB/s | Memory Bandwidth 76.8GB/s |
ECC No | ECC No |
TDP 125W | TDP Shared |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
Encoder Model NVENC 7 | Encoder Model Quick Sync Video 8 |
Decoder Model NVDEC 5 | Decoder Model Quick Sync Video 8 |
Form Factor Soldered | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV174 | Codename Xe LP |
Chip Variant GA104-150-A1 | Chip Variant GT1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 12, 2021 | Release Date May 11, 2021 |
Foundry Samsung | Foundry Intel |
Fabrication Node 8N | Fabrication Node Intel 7 |
Die Size 393mm² | Die Size 257mm² |
Transistor Count 17.4 Billion | Transistor Count 18.5 Billion |
Transistor Density 44.33 MTr/mm² | Transistor Density 72 MTr/mm² |
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