NVIDIA H200 SXM

H200 SXM

Samsung Xclipse 920

Xclipse 920

NVIDIA H200 SXM vs Samsung Xclipse 920 Full Specs

16,896 Shaders
1.98GHz
192 Shaders
1.3GHz
141GB HBM3e4.81TB/s
Shared Memory51.2GB/sLPDDR5
··
66.91 TFLOPS
··
499.2 GFLOPS
Form Factor
SXM5
Form Factor
iGPU
TDP
700W
TDP
Shared

H200 SXMH200 SXM3.96 POPSINT8 Tensor Sparse
x7928.12
Xclipse 920Xclipse 920499.2 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
3.96 POPSINT8 Tensor Sparse
Peak OPS
499.2 GFLOPSFP32
Tensor FP8-16
1.98 PFLOPS
FP8-16 Tensor Sparse
3.96 PFLOPS
Tensor FP8-32
1.98 PFLOPS
FP8-32 Tensor Sparse
3.96 PFLOPS
-
Tensor FP16-16
989.4 TFLOPS
FP16-16 Tensor Sparse
1.98 PFLOPS
Tensor FP16-32
989.4 TFLOPS
FP16-32 Tensor Sparse
1.98 PFLOPS
-
BF16
133.8 TFLOPS
Tensor BF16
989.4 TFLOPS
BF16 Tensor Sparse
1.98 PFLOPS
-
Tensor TF32
494.7 TFLOPS
Tensor TF32
-
FP32
66.91 TFLOPS
FP32
499.2 GFLOPS
FP64
33.45 TFLOPS
Tensor FP64
61.84 TFLOPS
-
Tensor INT8
1.98 POPS
-
Pixel Rate
47.5 GPixel/s
Pixel Rate
10.4 GPixel/s
Texture Rate
1.04 TTexel/s
Texture Rate
15.6 GTexel/s

Shaders
16,896 Shaders
Shaders
192 Shaders
TMUs
528 TMUs
TMUs
12 TMUs
ROPs
24 ROPs
ROPs
8 ROPs
Tensor Cores
528 T-Cores
Tensor Cores
-
RT Cores
-
RT Cores
3 RT-Cores
SMs
132 SMs
CUs
3 CUs

Base Clock
1.06GHz
Base Clock
-
Boost Clock
1.98GHz
Boost Clock
1.3GHz
Tensor Clock
1.83GHz
Tensor Clock
-

L1
64KB/SM Tex
L1
-
L2 Cache
50MB shared
L2 Cache
-

141GB HBM3e
Shared MemoryLPDDR5
Memory Bus
6144-bit
Memory Bus
64-bit
Memory Speed
6.3GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
4.81TB/s
Memory Bandwidth
51.2GB/s
ECC
No
ECC
No

TDP
700W
TDP
Shared

Adaptive Sync
G-Sync
FreeSync
Adaptive Sync
-
DSC
Not Supported
DSC
Not Supported

Shader Model
-
Shader Model
6.7
-
DirectX
DirectX 12
Direct3D
12_2
OpenGL
-
OpenCL
3
Vulkan
-
OpenGL
4.6
OpenCL
2.2
Vulkan
1.3
CUDA
9
GFX
-
PureVideo HD
VP11
VDPAU
Feature Set K
CUDA
-
GFX
10.3
PureVideo HD
-
VDPAU
-

Decoder
7x NVDEC 5
-
Codec
MPEG-1
MPEG-2
MPEG-4
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
-

Form Factor
SXM5
Form Factor
iGPU
PCIe
PCIe 5.0 x16
PCIe
-
Cooling
Passive
Cooling
Open-Air
Multi-GPU
Multi-GPU Support
Supported
Multi-GPU Type
NVLink
Multi-GPU
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
H200 SXM branding
Branding
Exynos 2200 branding
Codename
NV180
Codename
-
Market Segment
Server
Market Segment
Smartphone
Release Date
Nov 13, 2023
Release Date
Jan 1, 2022

Foundry
TSMC
Foundry
Samsung
Fabrication Node
4N
Fabrication Node
4LPE
Die Size
814mm²
Die Size
100mm²
Transistor Count
80B
Transistor Count
-
Transistor Density
98.28 MTr/mm²
Transistor Density
-