NVIDIA Quadro 3000M vs Intel Graphics 2C 2300MHz Full Specs

Summary

240 Shaders 450MHz	256 Shaders 2.3GHz
2GB GDDR580GB/s placeholder	Shared Memory119.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 432 GFLOPS	Peak·FP32·FP16 1.18 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 75W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Quadro 3000M432 GFLOPSFP32

x1

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x87.23

Show Top Score

Theoretical Performance

Clock Speed450MHz UC·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 432 GFLOPSFP32	Peak OPS 37.68 TOPSINT4 Tensor
-	Tensor FP16-32 9.42 TFLOPS
-	Tensor BF16 9.42 TFLOPS
FP32 432 GFLOPS	FP32 1.18 TFLOPS
FP64 36 GFLOPS	FP64 294.4 GFLOPS
Tensor INT4 -	Tensor INT4 37.68 TOPS
-	Tensor INT8 18.84 TOPS
Pixel Rate 28.8 GPixel/s	Pixel Rate 18.4 GPixel/s
Texture Rate 36 GTexel/s	Texture Rate 36.8 GTexel/s

Core Config

Shaders 240 Shaders	Shaders 256 Shaders
TMUs 40 TMUs	TMUs 16 TMUs
ROPs 32 ROPs	ROPs 8 ROPs
Tensor Cores -	Tensor Cores 16 T-Cores
RT Cores -	RT Cores 2 RT-Cores
SMs 5 SMs	EUs 16 EUs

Clocks

Boost Clock 450MHz	Boost Clock 2.3GHz
Shader Clock 900MHz	Shader Clock -

Cache

L2 Cache 512KB shared

L2 Cache 4.1MB shared

Memory

2GB GDDR5 placeholder	Shared Memory LPDDR5X·DDR5
Memory Bus 256-bit	Memory Bus 128-bit
Memory Speed 2.5GT/s	Memory Speed 7.5GT/s
Memory Bandwidth 80GB/s	Memory Bandwidth 119.5GB/s

Power & Thermals

TDP 75W

TDP Shared

Video Output

Multi-Monitor 2

Multi-Monitor 3

Encoder

-	Encoder Model Xe Media Engine

Decoder

Decoder Model VP4

Decoder Model Xe Media Engine

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Intel
Chip Designer NVIDIA	Chip Designer Intel
Architecture Fermi	Architecture Battlemage
Family Quadro F	Family Gen 13
Branding	Branding
Codename NVC4	Codename Xe3 LPG
Chip Variant GF104-225-A1	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Feb 22, 2011	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node 40nm	Fabrication Node Intel 3
Die Size 332mm²	Die Size 27mm²
Transistor Count 1.9 Billion	Transistor Count -
Transistor Density 5.87 MTr/mm²	Transistor Density -

Images

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Used In

CPUs -

CPUs Core Ultra 5 322 Core Ultra 5 332

Competitors

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