Qualcomm Adreno 680 vs Intel Graphics 4C 2500MHz Full Specs

Summary

1,536 Shaders 600MHz	512 Shaders 2.5GHz
Shared Memory68.3GB/sLPDDR4X	Shared Memory136.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 1.84 TFLOPS	Peak·FP32·FP16 2.56 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP 5W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Adreno 6803.69 TFLOPSFP16

x1

Graphics 4C 2500MHz81.92 TOPSINT4 Tensor

x22.22

Show Top Score

Theoretical Performance

Clock Speed600MHz UC·Boost·OC	Clock Speed2500MHz UC·Boost·OC
Peak OPS 3.69 TFLOPSFP16	Peak OPS 81.92 TOPSINT4 Tensor
-	Tensor FP16-32 20.48 TFLOPS
-	Tensor BF16 20.48 TFLOPS
FP32 1.84 TFLOPS	FP32 2.56 TFLOPS
FP64 460.8 GFLOPS	FP64 640 GFLOPS
Tensor INT4 -	Tensor INT4 81.92 TOPS
-	Tensor INT8 40.96 TOPS
Pixel Rate 28.8 GPixel/s	Pixel Rate 40 GPixel/s
Texture Rate 57.6 GTexel/s	Texture Rate 80 GTexel/s

Core Config

Shaders 1,536 Shaders	Shaders 512 Shaders
TMUs 96 TMUs	TMUs 32 TMUs
ROPs 48 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
RT Cores -	RT Cores 4 RT-Cores
EUs 12 EUs	EUs 32 EUs

Clocks

Boost Clock 600MHz

Boost Clock 2.5GHz

Cache

L2 Cache 512KB shared	L2 Cache 4.1MB shared
L3 Cache 3MB shared	L3 Cache -

Memory

Shared MemoryLPDDR4X	Shared Memory LPDDR5X·DDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 4.3GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 68.3GB/s	Memory Bandwidth 136.5GB/s

Power & Thermals

TDP 5W

TDP Shared

Video Output

Multi-Monitor 1

Multi-Monitor 3

Encoder

Encoder Model Hexagon 690

Encoder Model Xe Media Engine

Decoder

Decoder Model Hexagon 690

Decoder Model Xe Media Engine

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Qualcomm	Manufacturer Intel
Chip Designer Qualcomm	Chip Designer Intel
Architecture Adreno 600	Architecture Battlemage
Family Adreno 600	Family Gen 13
Branding	Branding
Codename -	Codename Xe3 LPG
Chip Variant -	Chip Variant GT1
Market Segment Smartphone	Market Segment Laptop
Release Date Jul 9, 2019	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N7	Fabrication Node Intel 3
Die Size -	Die Size 27mm²

Images

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Used In

CPUs Snapdragon 8cx Gen 1	CPUs Core Ultra 7 355 Core Ultra 7 365 Core Ultra 7 366H Show 1 more
Laptops Galaxy Book S(Mid 2019)	Laptops -

Competitors

QualcommAdreno 680 vs GPU QualcommAdreno 840 QualcommAdreno 680 vs GPU Apple5-Core A18 Pro QualcommAdreno 680 vs GPU Apple4-Core A19 Show 12 more

IntelGraphics 4C 2500MHz vs GPU IntelGraphics 4C 2450MHz IntelGraphics 4C 2500MHz vs GPU IntelGraphics 4C 2300MHz IntelGraphics 4C 2500MHz vs GPU AMDRadeon 860M 3000MHz Show 12 more