AMD Ryzen AI 9 HX 370 vs M4 Max (14C32G)
AMD Ryzen AI 9 HX 370
M4 Max (14C32G)
|
12 Cores
24 Threads
2GHz Clock
|
14 Cores
14 Threads
4.5GHz Clock
|
|
Socket
FP8
|
Socket
Unknown
|
|
iGPU
Radeon 890M 2900MHz
5.94 TFLOPS FP32
|
iGPU
32-Core M4 Max
13.74 TFLOPS FP32
|
GB6 Single-Core
|
|
Ryzen AI 9 HX 370 - GB6S 2,900
x1
M4 Max (14C32G) - GB6S 3,990
x1.38
GB6 Multi-Core
|
|
Ryzen AI 9 HX 370 - GB6M 14,720
x1
M4 Max (14C32G) - GB6M 22,690
x1.54
CB23 Single-Core
|
|
Ryzen AI 9 HX 370 - CB23S 2,035
x1
M4 Max (14C32G) - CB23S 2,170
x1.07
CB23 Multi-Core
|
|
Ryzen AI 9 HX 370 - CB23M 23,785
x1.06
M4 Max (14C32G) - CB23M 22,500
x1
|
|
Ryzen AI 9 HX 370 - 128.0GB/s
x1
M4 Max (14C32G) - 409.6GB/s
x3.2
|
|
Ryzen AI 9 HX 370 - 28W
x1
M4 Max (14C32G) - 90W
x3.21
|
|
Ryzen AI 9 HX 370 - 5.94 TFLOPS FP32
x1
M4 Max (14C32G) - 13.74 TFLOPS FP32
x2.31
|
|
Ryzen AI 9 HX 370 - 50 TOPS INT8
x1.32
M4 Max (14C32G) - 38 TOPS INT8
x1
|
GB6S 2,900
71%
|
GB6S 3,990
98%
|
|
GB6M 14,720
55%
|
GB6M 22,690
85%
|
|
CB23S 2,035
78%
|
CB23S 2,170
83%
|
|
CB23M 23,785
55%
|
CB23M 22,500
52%
|
|
Manufacturer
AMD
|
Manufacturer
Apple
|
|
Architecture
Zen 5
|
Architecture
Apple Silicon 14
|
|
Family
Ryzen AI 300
|
Family
M Series
|
|
Instruction Set (ISA)
x86-64
|
Instruction Set (ISA)
AArch64
|
|
Codename
Strix Point
-
P-Core
Zen 5
E-Core
Zen 5c
|
Codename
Hidra
M4 Max
P-Core
AS14P
E-Core
AS14E
|
|
Market Segment
Laptop
|
Market Segment
Laptop
|
|
Release Date
6/2/2024
|
Release Date
10/30/2024
|
|
Foundry
TSMC
|
Foundry
TSMC
|
|
Node
N4P
|
Node
N3E
|
|
Die Size
233 mm²
|
Die Size
519 mm²
|
|
Transistor Count
28 Billion
|
Transistor Count
95 Billion
|
| FP8 |
Unknown
|
|
12 Cores
4 P-Cores
8 E-Cores
|
14 Cores
10 P-Cores
4 E-Cores
|
|
24 Threads
8 P-Threads
16 E-Threads
|
14 Threads
10 P-Threads
4 E-Threads
|
|
-
2GHz
5.1GHz Boost
|
P-Core
4.5GHz
-
|
|
-
-
|
E-Core
2.75GHz
|
|
Overclocking
Locked
|
Overclocking
Locked
|
|
Type
PCIe
|
Integrated Chipset
-
|
|
Transfer Rate
16GT/s
|
-
-
|
|
Lanes
4
|
-
-
|
|
Bandwidth
8GB/s
|
-
-
|
|
Bi-directional
16GB/s
|
-
-
|
|
L0 Instruction
|
L0 Instruction
|
|
L0 Data
|
L0 Data
|
|
L1 Instruction
32KB/Core
8-way set associative
-
-
|
L1 Instruction
192KB/P-Core
6-way set associative
128KB/E-Core
4-way set associative
|
|
L1 Data
48KB/Core
12-way set associative
-
-
|
L1 Data
128KB/P-Core
4-way set associative
64KB/E-Core
2-way set associative
|
|
L2
1024KB/Core
16-way set associative
-
-
-
-
|
L2
-
-
32MB Shared
16-way set associative
4MB Shared (E-Core)
16-way set associative
|
|
L3
24MB Shared
16-way set associative
|
-
-
-
|
|
-
|
48MB SLC Cache
|
|
Channels
2
|
Channels
3
|
|
Max Memory
256GB
64GB
|
Max Memory
96GB
|
|
ECC
Not Supported
|
ECC
Not Supported
|
|
Bus Width/Channel
64Bit
Bus Width
128Bit
|
Bus Width/Channel
128Bit
Bus Width
384Bit
|
|
Clock
4000MHz
2800MHz
Transfer Rate
8000MT/s
5600MT/s
|
Clock
4267MHz
Transfer Rate
8533MT/s
|
|
Bandwidth/Channel
64.0GB/s
44.8GB/s
Bandwidth
128.0GB/s
89.6GB/s
|
Bandwidth/Channel
136.5GB/s
Bandwidth
409.6GB/s
|
|
TDP
28W
15W cTDP Down
54W cTDP Up
|
TDP
90W
-
-
|
|
Temp
100°C Max
|
Temp
100°C Max
|
|
Included Cooler
|
Included Cooler
|
|
PCIe 4.0 x16 Lanes
|
No PCIe
|
|
Radeon 890M 2900MHz
1024 Shaders
2900MHz
5.94 TFLOPS FP32
|
32-Core M4 Max
4096 Shaders
1678MHz
13.74 TFLOPS FP32
|
|
XDNA 2
|
-
|
|
32 Cores
|
16 Cores
|
|
50 TOPS INT8
|
38 TOPS INT8
|
|
No Cellular
|
No Cellular
|
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