AMD Ryzen AI 9 HX 375 vs Apple M3 Max (14C30G) Full Specs

Summary

12 Cores(4P+8E) 24 Threads(8P+16E) 2GHz	14 Cores(10P+4E) 14 Threads(10P+4E) 4.05GHz
TDP 28W	TDP 140W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 307.2GB/s LPDDR5
iGPU Radeon 890M 2900MHz	iGPU 30-Core M3 Max
Peak·FP32·FP16 11.88 TFLOPSFP16	Peak·FP32·FP16 10.6 TFLOPSFP16
Socket FP8	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 9 HX 3752,900

x1

M3 Max (14C30G)3,182

x1.10

Show Top Score

Core Config

12 Cores 4P 8E	14 Cores 10P 4E
24 Threads 8P 16E	14 Threads 10P 4E

Clocks

Base Clock 2GHz	Base Clock 4.05GHz
Boost Clock 5.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 48KB P -	L1d 128KB P 64KB E
L2 1MB P - -	L2 32MB P shared 4MB E shared
L3 24MB	L3 -
SLC Cache -	SLC Cache 48MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5
Max Memory 256GB	Max Memory 96GB
ECC No	ECC No
Channels 2	Channels 3
Bus Width 128-bit	Bus Width 384-bit
Speed 8000MT/s	Speed 6400MT/s
Bandwidth 128GB/s	Bandwidth 307.2GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 307.2GB/s

Power & Thermals

TDP 28W	TDP 140W
cTDP-down 15W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Radeon 890M 2900MHz	iGPU 30-Core M3 Max
Shaders 1024	Shaders 3840
Boost Clock 2.9GHz	Boost Clock 1.38GHz
Peak·FP32·FP16 11.88 TFLOPSFP16	Peak·FP32·FP16 10.6 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model H15 Erebus
NPU Cores 32	NPU Cores 16
NPU Clock -	NPU Clock 2.36GHz
Performance 55 TOPSINT8	Performance 18 TOPSFP16

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Apple Silicon 13ARMv8.6-A
Family Ryzen AI 300	Family M Series
Branding	Branding
Codename Strix Point - Zen 5P-Core Zen 5cE-Core	Codename Palma-M M3 MaxVariant EverestP-Core Sawtooth E-Core
Market Segment Laptop	Market Segment Desktop
Release Date Jun 2, 2024	Release Date Oct 30, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N3B
Die Size 233mm²	Die Size 477mm²
Transistor Count 28 Billion	Transistor Count 92 Billion
Transistor Density 120 MTr/mm²	Transistor Density 193 MTr/mm²

Images

No images available

No images available

Used In

Laptops -

Laptops MacBook Pro 16(M3 Max, Late 2023)MacBook Pro 14(M3 Max, Late 2023)

Competitors

AMDRyzen AI 9 HX 375 vs CPU IntelCore Ultra 5 235H AMDRyzen AI 9 HX 375 vs CPU IntelCore Ultra 7 265U AMDRyzen AI 9 HX 375 vs CPU IntelCore Ultra 5 225H Show 12 more

AppleM3 Max (14C30G) vs CPU AppleM5 Max (18C32G) AppleM3 Max (14C30G) vs CPU AppleM5 Max (18C40G) AppleM3 Max (14C30G) vs CPU AppleM4 (10C8G-FL) Show 12 more