GPUs

AMD Radeon 890M 2900MHz vs Apple 30-Core M3 Max Full Specs

1,024 Shaders
2.9GHz
3,840 Shaders
1.38GHz
Shared Memory128GB/s
·
Shared Memory307.2GB/sLPDDR5
··
5.94 TFLOPS
··
10.6 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 890M 2900MHzRadeon 890M 2900MHz11.88 TFLOPSFP16
x1.12
30-Core M3 Max30-Core M3 Max10.6 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
··
Peak OPS
11.88 TFLOPSFP16
Peak OPS
10.6 TFLOPSFP16
BF16
11.88 TFLOPS
-
FP32
5.94 TFLOPS
FP32
10.6 TFLOPS
FP64
371.2 GFLOPS
-
Pixel Rate
139.2 GPixel/s
Pixel Rate
165.6 GPixel/s
Texture Rate
185.6 GTexel/s
Texture Rate
331.2 GTexel/s

Shaders
1,024 Shaders
Shaders
3,840 Shaders
TMUs
64 TMUs
TMUs
240 TMUs
ROPs
48 ROPs
ROPs
120 ROPs
RT Cores
16 RT-Cores
RT Cores
30 RT-Cores
CUs
16 CUs
EUs
480 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.9GHz
Boost Clock
1.38GHz

L2 Cache
-
L2 Cache
8.2MB shared

Shared Memory
·
Shared MemoryLPDDR5
Memory Bus
128-bit
Memory Bus
384-bit
Memory Speed
8GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
307.2GB/s
ECC
No
ECC
No

Multi-Monitor
4
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
2x Apple Media Engine 3

Decoder Model
VCN 4.0
Decoder Model
Apple Media Engine 3

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
M3 Max branding
Codename
Strix Point
Codename
G15M
Market Segment
Laptop
Market Segment
Desktop
Release Date
Jun 2, 2024
Release Date
Oct 30, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N3B
Die Size
233mm²
Die Size
477mm²
Transistor Count
28 Billion
Transistor Count
92 Billion
Transistor Density
120 MTr/mm²
Transistor Density
193 MTr/mm²

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