Intel Core i7-1065G7 vs AMD Ryzen 9 6900HX Full Specs

Summary

4 Cores 8 Threads 1.3GHz	8 Cores 16 Threads 3.3GHz
TDP 15W	TDP 45W
Bandwidth 59.7GB/s LPDDR4·DDR4	Bandwidth 204.8GB/s LPDDR5·DDR5
iGPU Iris Plus 64EU 1100MHz	iGPU Radeon 680M 2400MHz
Peak·FP32·FP16 2.25 TFLOPSFP16	Peak·FP32·FP16 7.37 TFLOPSFP16
Socket BGA 1526	Socket FP7

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i7-1065G71,550

x1

Ryzen 9 6900HX2,146

x1.38

Show Top Score

Core Config

4 Cores	8 Cores
8 Threads	16 Threads

Clocks

Base Clock 1.3GHz	Base Clock 3.3GHz
Boost Clock 3.9GHz	Boost Clock 4.9GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 48KB	L1d 32KB
L2 512KB	L2 512KB
L3 8MB	L3 32MB

Memory

Type LPDDR4·DDR4	Type LPDDR5·DDR5
Max Memory 32GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 3733MT/s	Speed 6400MT/s
Bandwidth 59.7GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s

Power & Thermals

TDP 15W	TDP 45W
cTDP-down 12W	cTDP-down -
cTDP-up 25W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 95°C Max

Chipset Bus

Bus Type OPI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 8GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Iris Plus 64EU 1100MHz	iGPU Radeon 680M 2400MHz
Shaders 512	Shaders 768
Boost Clock 1.1GHz	Boost Clock 2.4GHz
Peak·FP32·FP16 2.25 TFLOPSFP16	Peak·FP32·FP16 7.37 TFLOPSFP16

NPU

NPU Model GNA 1.0

NPU Model -

Controller

Controller Model 495 Series U+	Controller Model -
Codename Ice Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Ice Lake	Architecture Zen 3+
Family Core 10th Gen	Family Ryzen 6000
Branding	Branding
Codename Ice Lake-U Sunny CoveP-Core	Codename Rembrandt -
Market Segment Laptop	Market Segment Laptop
Release Date Aug 1, 2019	Release Date Jan 4, 2022

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 10nm+ 14nmPCH	Fabrication Node N6 -
Die Size 122mm² 54mm²PCH	Die Size 210mm² -
Transistor Count 7 Billion	Transistor Count 13.1 Billion
Transistor Density 57 MTr/mm²	Transistor Density 62 MTr/mm²

Images

No images available

No images available

Used In

Laptops Blade Stealth 13(Late 2019)Blade Stealth 13(Early 2020)Galaxy Book Flex 13(Late 2019) Show 5 more	Laptops Alienware m15(R7 AMD, Early 2022)Blade 14(Early 2022)Alienware m17(R5, Early 2022) Show 2 more
Tablets Surface Pro 7(Intel 10th Gen, Late 2019)	Tablets -

Competitors

IntelCore i7-1065G7 vs CPU AMDRyzen 3 PRO 210 IntelCore i7-1065G7 vs CPU AMDRyzen AI 5 PRO 340 IntelCore i7-1065G7 vs CPU AMDRyzen AI 5 340 Show 12 more

AMDRyzen 9 6900HX vs CPU AMDRyzen 9 270 AMDRyzen 9 6900HX vs CPU AMDRyzen 7 250 AMDRyzen 9 6900HX vs CPU AMDRyzen 7 260 Show 12 more