Intel Core Ultra 5 235H vs Qualcomm Snapdragon X Plus (X1P-66-100)
Intel Core Ultra 5 235H
$354
Qualcomm Snapdragon X Plus (X1P-66-100)
14 Cores
14 Threads
2.4GHz Clock
|
10 Cores
10 Threads
3.4GHz Clock
|
Socket
BGA 2049
|
Socket
Unknown
|
iGPU
Arc 140T 2250MHz
4.61 TFLOPS FP32
|
iGPU
Adreno X1 3.8T
3.84 TFLOPS FP32
|
|
|
Core Ultra 5 235H - 134.4GB/s
x1
Snapdragon X Plus (X1P-66-100) - 135.2GB/s
x1.01
|
|
Core Ultra 5 235H - 28W
x1.22
Snapdragon X Plus (X1P-66-100) - 23W
x1
|
|
Core Ultra 5 235H - 4.61 TFLOPS FP32
x1.2
Snapdragon X Plus (X1P-66-100) - 3.84 TFLOPS FP32
x1
|
|
Core Ultra 5 235H - 13 TOPS INT8
x1
Snapdragon X Plus (X1P-66-100) - 45 TOPS INT8
x3.46
GB6S N/A
0%
|
GB6S 2,455
60%
|
GB6M N/A
0%
|
GB6M 13,470
51%
|
0%
|
0%
|
0%
|
0%
|
Manufacturer
Intel
|
Manufacturer
Qualcomm
|
Architecture
Arrow Lake
|
Architecture
Oryon
|
Family
Core Ultra Series 2
|
Family
X Series
|
Instruction Set (ISA)
x86-64
|
Instruction Set (ISA)
AArch64
|
Codename
Arrow Lake-H-4P-8E
P-Core
Lion Cove
M-Core
Skymont
E-Core
Crestmont
|
Codename
Snapdragon X Elite
-
Phoenix
-
-
-
-
|
Market Segment
Laptop
|
Market Segment
Laptop
|
Release Date
1/6/2025
|
Release Date
9/4/2024
|
Foundry
TSMC
TSMC (iGPU Die)
TSMC (SoC Die)
TSMC (IO Die)
|
Foundry
TSMC
-
-
-
|
Node
N3B
N5 (iGPU Die)
N6 (SoC Die)
N6 (IO Die)
|
Node
N4P
-
-
-
|
Die Size
Unknown
44 mm² (iGPU Die)
100 mm² (SoC Die)
28 mm² (IO Die)
|
Die Size
170 mm²
-
-
-
|
Transistor Count
Unknown
|
Transistor Count
Unknown
|
BGA 2049 |
Unknown
|
14 Cores
4 P-Cores
8 M-Cores
2 E-Cores
|
10 Cores
-
-
-
|
14 Threads
4 P-Threads
8 M-Cores
2 E-Threads
|
10 Threads
-
-
-
|
P-Core
2.4GHz
5GHz Boost
|
-
3.4GHz
4GHz Boost
|
M-Core
1.8GHz
|
-
-
|
E-Core
700MHz
2.5GHz Boost
|
-
-
-
|
Overclocking
Locked
|
Overclocking
Locked
|
Integrated Chipset
|
Integrated Chipset
|
L0 Instruction
|
L0 Instruction
|
L0 Data
|
L0 Data
|
L1 Instruction
64KB/P-Core
8-way set associative
64KB/E-Core
8-way set associative
|
L1 Instruction
192KB/Core
4-way set associative
-
-
|
L1 Data
48KB/P-Core
12-way set associative
32KB/E-Core
8-way set associative
|
L1 Data
96KB/Core
2-way set associative
-
-
|
L2
3072KB/Core
10-way set associative
-
-
8MB Shared (E-Core)
16-way set associative
|
L2
-
-
36MB Shared
12-way set associative
-
-
|
L3
12MB Shared
12-way set associative
|
-
-
-
|
-
|
6MB SLC Cache
|
Channels
2
|
Channels
8
|
Max Memory
128GB
128GB
|
Max Memory
64GB
|
ECC
Not Supported
|
ECC
Not Supported
|
Bus Width/Channel
64Bit
Bus Width
128Bit
|
Bus Width/Channel
16Bit
Bus Width
128Bit
|
Clock
4200MHz
3200MHz
Transfer Rate
8400MT/s
6400MT/s
|
Clock
4224MHz
Transfer Rate
8448MT/s
|
Bandwidth/Channel
67.2GB/s
51.2GB/s
Bandwidth
134.4GB/s
102.4GB/s
|
Bandwidth/Channel
16.9GB/s
Bandwidth
135.2GB/s
|
TDP
28W
20W cTDP Down
115W Peak
|
TDP
23W
-
-
|
Temp
110°C Max
|
-
-
|
Included Cooler
|
Included Cooler
|
PCIe 5.0 x8 Lanes
PCIe 4.0 x20 Lanes
|
No PCIe
|
Arc 140T 2250MHz
1024 Shaders
2250MHz
4.61 TFLOPS FP32
|
Adreno X1 3.8T
1536 Shaders
1250MHz
3.84 TFLOPS FP32
|
AI Boost 3
|
Hexagon
|
2 Cores
|
-
|
13 TOPS INT8
|
45 TOPS INT8
|
No Cellular
|
No Cellular
|














































































Copy Link