Intel Core Ultra 9 275HX vs Qualcomm Snapdragon X Elite (X1E-80-100)

Intel Core Ultra 9 275HX $689
Qualcomm Snapdragon X Elite (X1E-80-100)
24 Cores
24 Threads
2.7GHz Clock
12 Cores
12 Threads
3.4GHz Clock
Socket
BGA 2114
Socket
Unknown
iGPU
Graphics 4C 1900MHz
1.95 TFLOPS FP32
iGPU
Adreno X1 3.8T
3.84 TFLOPS FP32

GB6 Single-Core

  • 9% faster vs Snapdragon X Elite (X1E-80-100)
  • 8% slower vs Core Ultra 9 275HX
Core Ultra 9 275HX - GB6S 3,045
x1.09
Snapdragon X Elite (X1E-80-100) - GB6S 2,795
x1

GB6 Multi-Core

  • 6% faster vs Snapdragon X Elite (X1E-80-100)
  • 6% slower vs Core Ultra 9 275HX
Core Ultra 9 275HX - GB6M 15,410
x1.06
Snapdragon X Elite (X1E-80-100) - GB6M 14,470
x1
  • 24% slower vs Snapdragon X Elite (X1E-80-100)
  • 32% faster vs Core Ultra 9 275HX
Core Ultra 9 275HX - 102.4GB/s
x1
Snapdragon X Elite (X1E-80-100) - 135.2GB/s
x1.32
  • 31% lower vs Snapdragon X Elite (X1E-80-100)
  • 45% higher vs Core Ultra 9 275HX
Core Ultra 9 275HX - 55W
x1
Snapdragon X Elite (X1E-80-100) - 80W
x1.45
  • 49% slower vs Snapdragon X Elite (X1E-80-100)
  • 97% faster vs Core Ultra 9 275HX
Core Ultra 9 275HX - 1.95 TFLOPS FP32
x1
Snapdragon X Elite (X1E-80-100) - 3.84 TFLOPS FP32
x1.97
  • 71% slower vs Snapdragon X Elite (X1E-80-100)
  • 3.46x faster vs Core Ultra 9 275HX
Core Ultra 9 275HX - 13 TOPS INT8
x1
Snapdragon X Elite (X1E-80-100) - 45 TOPS INT8
x3.46
GB6S 2,795
69%
GB6M 14,470
54%
CB23S N/A
0%
CB23S 1,710
66%
CB23M N/A
0%
CB23M 13,370
31%
Manufacturer
Intel
Manufacturer
Qualcomm
Architecture
Arrow Lake
Architecture
Oryon
Family
Core Ultra Series 2
Family
X Series
Instruction Set (ISA)
x86-64
Instruction Set (ISA)
AArch64
Codename
Arrow Lake-S-8P-16E
P-Core
Lion Cove
E-Core
Skymont
Codename
Snapdragon X Elite
-
Phoenix
-
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
1/6/2025
Release Date
4/24/2024
Foundry
TSMC
TSMC (iGPU Die)
TSMC (SoC Die)
TSMC (IO Die)
Foundry
TSMC
-
-
-
Node
N3B
N5 (iGPU Die)
N6 (SoC Die)
N6 (IO Die)
Node
N4P
-
-
-
Die Size
135 mm²
23 mm² (iGPU Die)
100 mm² (SoC Die)
28 mm² (IO Die)
Die Size
170 mm²
-
-
-
Transistor Count
Unknown
Transistor Count
Unknown
BGA 2114
Unknown
24 Cores
8 P-Cores
16 E-Cores
12 Cores
-
-
24 Threads
8 P-Threads
16 E-Threads
12 Threads
-
-
P-Core
2.7GHz
5.4GHz Boost
-
3.4GHz
4GHz Boost
E-Core
2.1GHz
4.6GHz Boost
-
-
-
Overclocking
Unlocked
Overclocking
Locked
Type
DMI
Integrated Chipset
-
Transfer Rate
16GT/s
-
-
Lanes
8
-
-
Bandwidth
16GB/s
-
-
Bi-directional
32GB/s
-
-
L1 Instruction
64KB/P-Core
8-way set associative
64KB/E-Core
8-way set associative
L1 Instruction
192KB/Core
4-way set associative
-
-
L1 Data
48KB/P-Core
12-way set associative
32KB/E-Core
8-way set associative
L1 Data
96KB/Core
2-way set associative
-
-
L2
3072KB/Core
10-way set associative
-
-
16MB Shared (E-Core)
16-way set associative
L2
-
-
36MB Shared
12-way set associative
-
-
L3
24MB Shared
12-way set associative
-
-
-
-
6MB SLC Cache
Channels
2
Channels
8
Max Memory
192GB
Max Memory
64GB
ECC
Not Supported
ECC
Not Supported
Bus Width/Channel
64Bit
Bus Width
128Bit
Bus Width/Channel
16Bit
Bus Width
128Bit
Clock
3200MHz
Transfer Rate
6400MT/s
Clock
4224MHz
Transfer Rate
8448MT/s
Bandwidth/Channel
51.2GB/s
Bandwidth
102.4GB/s
Bandwidth/Channel
16.9GB/s
Bandwidth
135.2GB/s
TDP
55W
45W cTDP Down
160W Peak
TDP
80W
-
-
Temp
105°C Max
-
-
PCIe 5.0 x20 Lanes
PCIe 4.0 x4 Lanes
No PCIe
Graphics 4C 1900MHz
512 Shaders
1900MHz
1.95 TFLOPS FP32
Adreno X1 3.8T
1536 Shaders
1250MHz
3.84 TFLOPS FP32
AI Boost 3
Hexagon
2 Cores
-
13 TOPS INT8
45 TOPS INT8
No Cellular
No Cellular
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