Qualcomm Snapdragon 8 Gen 3 vs Apple M1 (8C8G-FL) Full Specs

Summary

8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.3GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 3.2GHz
TDP 5W	TDP 10W
Bandwidth 76.8GB/s LPDDR5X	Bandwidth 68.3GB/s LPDDR4X
iGPU Adreno 750	iGPU 8-Core M1-FL
Peak·FP32·FP16 5.53 TFLOPSFP16	Peak·FP32·FP16 2.62 TFLOPSFP16

Core Config

8 Cores 1P 5M 2E	8 Cores 4P - 4E
8 Threads 1P 5M 2E	8 Threads 4P - 4E

Clocks

Base Clock 3.3GHz	Base Clock 3.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 192KB P - 128KB E
L1d 64KB P 64KB M 32KB E	L1d 128KB P - 64KB E
L2 1MB P 512KB M 128KB E - -	L2 12MB P shared 4MB E shared
L3 12MB	L3 -
SLC Cache 4MB	SLC Cache 8MB

Memory

Type LPDDR5X	Type LPDDR4X
Max Memory 24GB	Max Memory 16GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 9600MT/s	Speed 4266MT/s
Bandwidth 76.8GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate9600MT/s UC·Spec·OC 76.8GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s UC·Spec·OC 68.3GB/s

Power & Thermals

TDP 5W	TDP 10W
Max Operating Temp -	Max Operating Temp 100°C Max

Expansion

-	PCIe PCIe 4.0 x5 9.8GB/sBandwidth

iGPU

iGPU Adreno 750	iGPU 8-Core M1-FL
Shaders 1536	Shaders 1024
Boost Clock 900MHz	Boost Clock 1.28GHz
Peak·FP32·FP16 5.53 TFLOPSFP16	Peak·FP32·FP16 2.62 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model H13 Styx
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 1.46GHz
Performance 45 TOPSINT8	Performance 11 TOPSFP16

Cellular

Modem Model X75	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 10.0Gbps	Peak Down -
Peak Up Up to 3.5Gbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture KryoARMv9.0-A	Architecture Apple Silicon 10ARMv8.5-A
Family 8 Series	Family M Series
Branding	Branding
Codename - Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core	Codename Tonga M1Variant FirestormP-Core - IcestormE-Core
Market Segment Smartphone	Market Segment Tablet
Release Date Oct 24, 2023	Release Date Nov 10, 2020

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N5
Die Size 137mm²	Die Size 123mm²
Transistor Count -	Transistor Count 16 Billion
Transistor Density -	Transistor Density 130 MTr/mm²

Images

Used In

Laptops -	Laptops MacBook Air 13(M1, Late 2020)
Smartphones OnePlus 12OnePlus 13R	Smartphones -
Tablets OnePlus Pad 2(SD 8G3, Mid 2024)	Tablets iPad Air 5(M1, Early 2022)iPad Pro 11" Gen 3(M1, Early 2021)iPad Pro 12.9" Gen 5(M1, Early 2021)

Competitors

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AppleM1 (8C8G-FL) vs CPU AppleM2 (8C8G-FL) AppleM1 (8C8G-FL) vs CPU AppleM2 (8C10G-FL) AppleM1 (8C8G-FL) vs CPU AppleM2 (8C9G-FL) Show 12 more