AMD EPYC 3451 vs Qualcomm Snapdragon X2 Elite Extreme (X2E-96-100) Full Specs

Summary

16 Cores 32 Threads 2.15GHz	18 Cores(12P+6E) 18 Threads(12P+6E) 4.4GHz
TDP 100W	TDP 80W
Bandwidth 85.3GB/s DDR4	Bandwidth 228.6GB/s LPDDR5X
iGPU -	iGPU Adreno X2-90 7.6T
Peak·FP32·FP16 -	Peak·FP32·FP16 15.16 TFLOPSFP16
Socket SP4	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

EPYC 3451745

x1

Snapdragon X2 Elite Extreme (X2E-96-100)-

-

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Core Config

16 Cores 16P -	18 Cores 12P 6E
32 Threads 32P -	18 Threads 12P 6E

Clocks

Base Clock 2.15GHz	Base Clock 4.4GHz
Boost Clock 3GHz	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 96KB P 64KB E
L2 512KB P - -	L2 36MB P shared 12MB E shared
L3 32MB	L3 -

Memory

Type DDR4	Type LPDDR5X
Max Memory 64GB	Max Memory 192GB
ECC Yes	ECC No
Channels 4	Channels 12
Bus Width 256-bit	Bus Width 192-bit
Speed 2666MT/s	Speed 9523MT/s
Bandwidth 85.3GB/s	Bandwidth 228.6GB/s
Bandwidth Calculator Channels Transfer Rate2666MT/s Calculated Bandwidth 85.3GB/s	Bandwidth Calculator Channels Transfer Rate9523MT/s Calculated Bandwidth 228.6GB/s

Power & Thermals

TDP 100W	TDP 80W
cTDP-down 80W	cTDP-down -
Max Operating Temp 105°C Max	Max Operating Temp -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 8GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x64 63GB/sBandwidth	PCIe PCIe 5.0 x12 47.3GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU -	iGPU Adreno X2-90 7.6T
Shaders -	Shaders 2048
Boost Clock -	Boost Clock 1.85GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 15.16 TFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon
Performance -	Performance 80 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Zen	Architecture Oryon 3ARMv8.7-A
Family EPYC 3001	Family X Series
Branding	Branding
Codename Snowy Owl ZeppelinDie Snowy Owl 16CVariant - -	Codename Glymur - - Pegasus-PP-Core Pegasus-EE-Core
Market Segment Embedded	Market Segment Laptop
Release Date Feb 1, 2018	Release Date Sep 24, 2025

Fabrication

Foundry GlobalFoundries	Foundry TSMC
Fabrication Node 14LP	Fabrication Node N3E
Die Size 426mm²	Die Size 288mm²
Transistor Count 9.6 Billion	Transistor Count -
Transistor Density 23 MTr/mm²	Transistor Density -

Images

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Competitors

AMDEPYC 3451 vs CPU QualcommSnapdragon X2 Elite (X2E-88-100)

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