CPUs

AMD R1305G vs Intel Core i3-2115C Full Specs

2 Cores
4 Threads
1.5GHz
2 Cores
4 Threads
2GHz
TDP
10W
TDP
25W
Bandwidth
38.4GB/s
DDR4
Bandwidth
25.6GB/s
·
iGPU
iGPU
-
··
768 GFLOPSFP16
··
-
Socket
Socket

2 Cores
2 Cores
4 Threads
4 Threads

Base Clock
1.5GHz
Base Clock
2GHz
Boost Clock
2.8GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
64KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
512KB
L2
256KB
L3
4MB
L3
3MB

Type
DDR4
Type
·
Max Memory
64GB
Max Memory
16GB
ECC
Yes
ECC
Yes
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
2400MT/s
Speed
1600MT/s
Bandwidth
38.4GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
38.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
25.6GB/s

TDP
10W
TDP
25W
cTDP-down
8W
cTDP-down
-
Max Operating Temp
-
Max Operating Temp
100°C Max
Included Cooler
-
Included Cooler
0

Bus Type
PCIe
Bus Type
DMI
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
8GT/s
Bus Speed
5GT/s
Bus Bandwidth
4GB/s
Bus Bandwidth
2.5GB/s

PCIe
PCIe 3.0 x4
3.9GB/sBandwidth
PCIe
PCIe 2.0 x16
8GB/sBandwidth

iGPU
iGPU
-
Shaders
192
Shaders
-
Boost Clock
1GHz
Boost Clock
-
··
768 GFLOPSFP16
··
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
R Series 2019 branding
Branding
Core i3 2011 branding
Codename
Banded Kestrel
-
-
Codename
Gladden
Sandy Bridge-M-2Die
Sandy Bridge-2C-GT1Variant
Market Segment
Embedded
Market Segment
Embedded
Release Date
Feb 25, 2020
Release Date
May 1, 2012

Foundry
GlobalFoundries
Foundry
Intel
Fabrication Node
14LP
Fabrication Node
32nm
Die Size
149mm²
Die Size
131mm²
Transistor Count
3.5 Billion
Transistor Count
504 Million
Transistor Density
24 MTr/mm²
Transistor Density
4 MTr/mm²