AMD Ryzen 3 210 vs Intel Core i7-4760HQ Full Specs

Summary

4 Cores(1P+3E) 8 Threads(2P+6E) 3GHz	4 Cores 8 Threads 2.1GHz
TDP 28W	TDP 47W
Bandwidth 120GB/s LPDDR5X·DDR5	Bandwidth 25.6GB/s DDR3L
iGPU Radeon 740M 2500MHz	iGPU Iris Pro 5200 1200MHz
Peak·FP32·FP16 2.56 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP32
Socket FP8	Socket BGA 1364

Highlights

Max Bandwidth

Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Ryzen 3 210120GB/s

x4.69

Core i7-4760HQ25.6GB/s

x1

Core Config

4 Cores 1P 3E	4 Cores 4P -
8 Threads 2P 6E	8 Threads 8P -

Clocks

Base Clock 3GHz	Base Clock 2.1GHz
Boost Clock 4.7GHz	Boost Clock 3.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 1MB P	L2 256KB P
L3 8MB	L3 6MB
L4 Cache -	L4 Cache 128MB

Memory

Type LPDDR5X·DDR5	Type DDR3L
Max Memory 256GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 7500MT/s	Speed 1600MT/s
Bandwidth 120GB/s	Bandwidth 25.6GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s	Bandwidth Calculator Channels Transfer Rate1600MT/s Calculated Bandwidth 25.6GB/s

Power & Thermals

TDP 28W	TDP 47W
cTDP-down 15W	cTDP-down -
cTDP-up 30W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 5GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2.5GB/s

Expansion

PCIe PCIe 4.0 x14 27.6GB/sBandwidth

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

iGPU

iGPU Radeon 740M 2500MHz	iGPU Iris Pro 5200 1200MHz
Shaders 256	Shaders 320
Boost Clock 2.5GHz	Boost Clock 1.2GHz
Peak·FP32·FP16 2.56 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP32

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 4	Architecture Haswell
Family Ryzen 200	Family Core 4th Gen
Branding	Branding
Codename Hawk Point Hawk Point SVariant Zen 4P-Core Zen 4cE-Core	Codename Crystalwell - - -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Apr 1, 2014

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries InteleDRAM
Fabrication Node N4 -	Fabrication Node 22nm 22nmeDRAM
Die Size 137mm² -	Die Size 260mm² 77mm²eDRAM
Transistor Count 20.9 Billion	Transistor Count 1.7 Billion
Transistor Density 153 MTr/mm²	Transistor Density 7 MTr/mm²

Images

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