AMD Ryzen 3 3200U vs Intel Core Ultra X9 388H Full Specs
2 Cores 4 Threads 2.6GHz | 16 Cores(4P+8M+4E) 16 Threads(4P+8M+4E) 2.1GHz |
TDP 15W | TDP 25W |
Bandwidth 38.4GB/s DDR4 | Bandwidth 153.6GB/s LPDDR5X |
iGPU | iGPU |
·· 921.6 GFLOPSFP16 | ·· 245.8 TFLOPSFP16 |
Socket | Socket |
2 Cores 2P - - | 16 Cores 4P 8M 4E |
4 Threads 4P - - | 16 Threads 4P 8M 4E |
Base Clock 2.6GHz | Base Clock 2.1GHz |
Boost Clock 3.5GHz | Boost Clock 5.1GHz |
Overclocking Locked | Overclocking Locked |
L0i - | L0i 64KB |
L0d - | L0d 48KB |
L1i 64KB P - - | L1i - 64KB M 64KB E |
L1d 32KB P - - | L1d 192KB P 32KB M 32KB E |
L2 512KB P - - | L2 3MB P 8MB M shared 4MB E shared |
L3 4MB | L3 18MB |
Type DDR4 | Type LPDDR5X |
Max Memory 64GB | Max Memory 96GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 2400MT/s | Speed 9600MT/s |
Bandwidth 38.4GB/s | Bandwidth 153.6GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 38.4GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 153.6GB/s |
TDP 15W | TDP 25W |
cTDP-down 12W | cTDP-down 15W |
cTDP-up 25W | cTDP-up - |
Peak Power - | Peak Power 80W |
Max Operating Temp 95°C Max | Max Operating Temp 100°C Max |
Included Cooler 0 | Included Cooler - |
Bus Type PCIe | Bus Type - |
Bus Config 4 lanes | Bus Config - |
Bus Speed 8GT/s | Bus Speed - |
Bus Bandwidth 4GB/s | Bus Bandwidth - |
PCIe PCIe 3.0 x87.9GB/sBandwidth | PCIe PCIe 5.0 x415.8GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x815.8GB/sBandwidth |
iGPU | iGPU |
Shaders 192 | Shaders 1536 |
Boost Clock 1.2GHz | Boost Clock 2.5GHz |
·· 921.6 GFLOPSFP16 | ·· 245.8 TFLOPSFP16 |
NPU Model - | NPU Model NPU 5 |
NPU Cores - | NPU Cores 3 |
Performance - | Performance 50 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Raven Ridge - - - - | Codename Panther Lake-X Panther Lake-X-4P-12EVariant Cougar CoveP-Core DarkmontM-Core DarkmontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 6, 2019 | Release Date Jan 5, 2026 |
Foundry GlobalFoundries | Foundry Intel |
Other Foundries - | Other Foundries TSMCiGPU TSMCPCH |
Fabrication Node 14LP - - | Fabrication Node Intel 18A N3EiGPU N6PCH |
Die Size 210mm² - - | Die Size 114mm² 54mm²iGPU 49mm²PCH |
Transistor Count 4.9 Billion - | Transistor Count - 4 MillionPCH |
Transistor Density 24 MTr/mm² | Transistor Density - |
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