AMD Ryzen 3 5125C vs Intel Core i5-6360U Full Specs

Summary

2 Cores 4 Threads 3GHz	2 Cores 4 Threads 2GHz
TDP 15W	TDP 15W
Bandwidth 68.3GB/s LPDDR4X·DDR4	Bandwidth 34.1GB/s DDR4·LPDDR3·DDR3L
iGPU Radeon Vega 3 1400MHz	iGPU Iris 540 1000MHz
Peak·FP32·FP16 1.07 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP32
Socket FP6	Socket BGA 1356

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Ryzen 3 5125C1,266

x1.33

Core i5-6360U951

x1

Show Top Score

Core Config

2 Cores	2 Cores
4 Threads	4 Threads

Clocks

Base Clock 3GHz	Base Clock 2GHz
Boost Clock 3GHz	Boost Clock 3.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 512KB	L2 256KB
L3 8MB	L3 4MB
L4 Cache -	L4 Cache 64MB

Memory

Type LPDDR4X·DDR4	Type DDR4·LPDDR3·DDR3L
Max Memory 32GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 4266MT/s	Speed 2133MT/s
Bandwidth 68.3GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s UC·Spec·OC 68.3GB/s	Bandwidth Calculator Channels Transfer Rate2133MT/s UC·Spec·OC 34.1GB/s

Power & Thermals

TDP 15W	TDP 15W
cTDP-down -	cTDP-down 10W
Max Operating Temp 95°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 8GT/s	Bus Speed 4GT/s
Bus Bandwidth 4GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 3.0 x12 11.8GB/sBandwidth

iGPU

iGPU Radeon Vega 3 1400MHz	iGPU Iris 540 1000MHz
Shaders 192	Shaders 384
Boost Clock 1.4GHz	Boost Clock 1GHz
Peak·FP32·FP16 1.07 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP32

Controller

Controller Model -	Controller Model 100 Series U+
Codename -	Codename Skylake
PCIe -	PCIe -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 3	Architecture Skylake
Family Ryzen 5000	Family Core 6th Gen
Branding	Branding
Codename Barcelo -	Codename Skylake-U Skylake-2C-GT3Variant
Market Segment Laptop	Market Segment Laptop
Release Date May 5, 2022	Release Date Sep 1, 2015

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries InteleDRAM IntelPCH
Fabrication Node N7 - -	Fabrication Node 14nm 22nmeDRAM 22nmPCH
Die Size 180mm² - -	Die Size 148mm² 42mm²eDRAM 50mm²PCH
Transistor Count 10.7B	Transistor Count 2.5B
Transistor Density 59 MTr/mm²	Transistor Density 17 MTr/mm²

Images

Used In

Laptops -

Laptops AppleMacBook Pro 13Two Ports, Late 2016

Competitors

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