CPUs

AMD Ryzen 3 PRO 8300GE vs AMD Sempron 3850 Full Specs

4 Cores(1P+3E)
8 Threads(2P+6E)
3.5GHz
4 Cores
4 Threads
1.3GHz
TDP
35W
TDP
25W
Bandwidth
83.2GB/s
DDR5
Bandwidth
12.8GB/s
DDR3
iGPU
iGPU
··
2.66 TFLOPSFP16
··
115.2 GFLOPSFP32
Socket
Socket

Ryzen 3 PRO 8300GERyzen 3 PRO 8300GE2,250
x15.10
Sempron 3850Sempron 3850149
x1

4 Cores
1P
3E
4 Cores
4P
-
8 Threads
2P
6E
4 Threads
4P
-

Base Clock
3.5GHz
Base Clock
1.3GHz
Boost Clock
4.9GHz
Boost Clock
-
Overclocking
Unlocked
Overclocking
Locked

L1i
32KB P
L1i
32KB P
L1d
32KB P
L1d
32KB P
L2
1MB P
-
L2
2MB P shared
L3
8MB
L3
-

Type
DDR5
Type
DDR3
Max Memory
256GB
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
1
Bus Width
128-bit
Bus Width
64-bit
Speed
5200MT/s
Speed
1600MT/s
Bandwidth
83.2GB/s
Bandwidth
12.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
83.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
12.8GB/s

TDP
35W
TDP
25W
Max Operating Temp
95°C Max
Max Operating Temp
-

Bus Type
PCIe
Bus Type
-
Bus Config
4 lanes
Bus Config
-
Bus Speed
16GT/s
Bus Speed
-
Bus Bandwidth
8GB/s
Bus Bandwidth
-

PCIe
PCIe 4.0 x10
19.7GB/sBandwidth
PCIe
PCIe 2.0 x4
2GB/sBandwidth

iGPU
iGPU
Shaders
256
Shaders
128
Boost Clock
2.6GHz
Boost Clock
450MHz
··
2.66 TFLOPSFP16
··
115.2 GFLOPSFP32

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 3 2024 branding
Branding
Sempron 2012 branding
Codename
Phoenix 2
Zen 4P-Core
Zen 4cE-Core
Codename
Kabini
-
-
Market Segment
Desktop
Market Segment
Desktop
Release Date
Apr 16, 2024
Release Date
Apr 9, 2014

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4
Fabrication Node
28nm
Die Size
137mm²
Die Size
107mm²
Transistor Count
20.9 Billion
Transistor Count
914 Million
Transistor Density
153 MTr/mm²
Transistor Density
9 MTr/mm²

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