CPUs

AMD Ryzen 3 PRO 8300GE vs Intel Core 2 Extreme QX9775 Full Specs

4 Cores(1P+3E)
8 Threads(2P+6E)
3.5GHz
4 Cores
4 Threads
3.2GHz
TDP
35W
TDP
150W
Bandwidth
83.2GB/s
DDR5
Bandwidth
-
iGPU
iGPU
-
··
2.66 TFLOPSFP16
··
-
Socket
Socket

Ryzen 3 PRO 8300GERyzen 3 PRO 8300GE2,250
x5.42
Core 2 Extreme QX9775Core 2 Extreme QX9775415
x1

4 Cores
1P
3E
4 Cores
4P
-
8 Threads
2P
6E
4 Threads
4P
-

Base Clock
3.5GHz
Base Clock
3.2GHz
Boost Clock
4.9GHz
Boost Clock
-
Overclocking
Unlocked
Overclocking
Unlocked

L1i
32KB P
L1i
32KB P
L1d
32KB P
L1d
32KB P
L2
1MB P
-
L2
12MB P shared
L3
8MB
L3
-

Type
DDR5
Type
-
Max Memory
256GB
Max Memory
-
ECC
No
ECC
-
Channels
2
Channels
-
Bus Width
128-bit
Bus Width
-
Speed
5200MT/s
Speed
-
Bandwidth
83.2GB/s
Bandwidth
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
83.2GB/s
Bandwidth Calculator
-

TDP
35W
TDP
150W
Max Operating Temp
95°C Max
Max Operating Temp
-
T-Case
-
T-Case
63°C Max
Voltage Range
-
Voltage Range
-
Included Cooler
-
Included Cooler
0

Bus Type
PCIe
Bus Type
FSB
Bus Config
4 lanes
Bus Config
64-bit
Bus Speed
16GT/s
Bus Speed
1.6GT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
12.8GB/s

PCIe
PCIe 4.0 x10
19.7GB/sBandwidth
-

iGPU
iGPU
-
Shaders
256
Shaders
-
Boost Clock
2.6GHz
Boost Clock
-
··
2.66 TFLOPSFP16
··
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 3 2024 branding
Branding
Core 2 Extreme 2006 branding
Codename
Phoenix 2
Zen 4P-Core
Zen 4cE-Core
Codename
Yorkfield-XE
-
-
Market Segment
Desktop
Market Segment
Desktop
Release Date
Apr 16, 2024
Release Date
Mar 1, 2008

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4
Fabrication Node
45nm
Die Size
137mm²
Die Size
214mm²
Transistor Count
20.9 Billion
Transistor Count
820 Million
Transistor Density
153 MTr/mm²
Transistor Density
4 MTr/mm²

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