CPUs

AMD Ryzen 3 PRO 8300GE vs Intel Pentium MMX 233 Full Specs

4 Cores(1P+3E)
8 Threads(2P+6E)
3.5GHz
1 Cores
1 Threads
233MHz
TDP
35W
TDP
17W
Bandwidth
83.2GB/s
DDR5
Bandwidth
-
iGPU
iGPU
-
··
2.66 TFLOPSFP16
··
-
Socket
Socket

Ryzen 3 PRO 8300GERyzen 3 PRO 8300GE2,250
x1
Pentium MMX 233Pentium MMX 233-
-

4 Cores
1P
3E
1 Cores
1P
-
8 Threads
2P
6E
1 Threads
1P
-

Base Clock
3.5GHz
Base Clock
233MHz
Boost Clock
4.9GHz
Boost Clock
-
Overclocking
Unlocked
Overclocking
Locked

L1i
32KB P
L1i
16KB P
L1d
32KB P
L1d
16KB P
L2
1MB P
L2
-
L3
8MB
L3
-

Type
DDR5
Type
-
Max Memory
256GB
Max Memory
-
ECC
No
ECC
-
Channels
2
Channels
-
Bus Width
128-bit
Bus Width
-
Speed
5200MT/s
Speed
-
Bandwidth
83.2GB/s
Bandwidth
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
83.2GB/s
Bandwidth Calculator
-

TDP
35W
TDP
17W
Max Operating Temp
95°C Max
Max Operating Temp
-

Bus Type
PCIe
Bus Type
FSB
Bus Config
4 lanes
Bus Config
64-bit
Bus Speed
16GT/s
Bus Speed
66MT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
0.5GB/s

PCIe
PCIe 4.0 x10
19.7GB/sBandwidth
-

iGPU
iGPU
-
Shaders
256
Shaders
-
Boost Clock
2.6GHz
Boost Clock
-
··
2.66 TFLOPSFP16
··
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-32
Architecture
Architecture
Family
Family
Branding
Ryzen 3 2024 branding
Branding
Pentium MMX 1997 branding
Codename
Phoenix 2
Zen 4P-Core
Zen 4cE-Core
Codename
P55C
-
-
Market Segment
Desktop
Market Segment
Desktop
Release Date
Apr 16, 2024
Release Date
Jun 2, 1997

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4
Fabrication Node
350nm
Die Size
137mm²
Die Size
141mm²
Transistor Count
20.9 Billion
Transistor Count
4.5 Million
Transistor Density
153 MTr/mm²
Transistor Density
-

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