CPUs

AMD Ryzen 7 PRO 250 vs Intel Core 2 Duo SP7700 Full Specs

8 Cores
16 Threads
3.3GHz
2 Cores
2 Threads
1.8GHz
TDP
28W
TDP
20W
Bandwidth
120GB/s
·
Bandwidth
-
iGPU
iGPU
-
··
8.29 TFLOPSFP16
··
-
Socket
Socket

Ryzen 7 PRO 250Ryzen 7 PRO 2502,300
x14.20
Core 2 Duo SP7700Core 2 Duo SP7700162
x1

8 Cores
2 Cores
16 Threads
2 Threads

Base Clock
3.3GHz
Base Clock
1.8GHz
Boost Clock
5.1GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
1MB
L2
4MB shared
L3
16MB
L3
-

Type
·
Type
-
Max Memory
256GB
Max Memory
-
ECC
No
ECC
-
Channels
2
Channels
-
Bus Width
128-bit
Bus Width
-
Speed
7500MT/s
Speed
-
Bandwidth
120GB/s
Bandwidth
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s
Bandwidth Calculator
-

TDP
28W
TDP
20W
cTDP-down
15W
cTDP-down
-
cTDP-up
30W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
-
Voltage Range
-
Voltage Range
-

Bus Type
PCIe
Bus Type
FSB
Bus Config
4 lanes
Bus Config
64-bit
Bus Speed
16GT/s
Bus Speed
800MT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
6.4GB/s

PCIe
PCIe 4.0 x20
39.4GB/sBandwidth
-

iGPU
iGPU
-
Shaders
768
Shaders
-
Boost Clock
2.7GHz
Boost Clock
-
··
8.29 TFLOPSFP16
··
-

NPU Model
XDNA
NPU Model
-
Performance
16 TOPSINT4
Performance
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 7 2024 branding
Branding
Core 2 Duo 2006 branding
Codename
Hawk Point
Codename
Merom
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Jan 1, 2007

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4
Fabrication Node
65nm
Die Size
178mm²
Die Size
143mm²
Transistor Count
25 Billion
Transistor Count
291 Million
Transistor Density
140 MTr/mm²
Transistor Density
2 MTr/mm²

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