AMD Ryzen 9 270 vs Apple M2 Pro (10C16G) Full Specs

Summary

8 Cores 16 Threads 4GHz	10 Cores(6P+4E) 10 Threads(6P+4E) 3.5GHz
TDP 45W	TDP 60W
Bandwidth 120GB/s LPDDR5X·DDR5	Bandwidth 204.8GB/s LPDDR5
iGPU Radeon 780M 2700MHz	iGPU 16-Core M2 Pro
Peak·FP32·FP16 8.29 TFLOPSFP16	Peak·FP32·FP16 5.73 TFLOPSFP16
Socket FP8	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen 9 2702,387

x1

M2 Pro (10C16G)2,680

x1.12

Show Top Score

Core Config

8 Cores 8P -	10 Cores 6P 4E
16 Threads 16P -	10 Threads 6P 4E

Clocks

Base Clock 4GHz	Base Clock 3.5GHz
Boost Clock 5.2GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 128KB P 64KB E
L2 1MB P - -	L2 24MB P shared 4MB E shared
L3 16MB	L3 -
SLC Cache -	SLC Cache 24MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5
Max Memory 256GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 7500MT/s	Speed 6400MT/s
Bandwidth 120GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s

Power & Thermals

TDP 45W	TDP 60W
cTDP-down 35W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Radeon 780M 2700MHz	iGPU 16-Core M2 Pro
Shaders 768	Shaders 2048
Boost Clock 2.7GHz	Boost Clock 1.4GHz
Peak·FP32·FP16 8.29 TFLOPSFP16	Peak·FP32·FP16 5.73 TFLOPSFP16

NPU

NPU Model XDNA	NPU Model H14 Selene
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.1GHz
Performance 16 TOPSINT4	Performance 15.8 TOPSFP16

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 4	Architecture Apple Silicon 11ARMv8.5-A
Family Ryzen 200	Family M Series
Branding	Branding
Codename Hawk Point - - -	Codename Rhodes-Chop M2 ProVariant AvalancheP-Core BlizzardE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 17, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4	Fabrication Node N5P
Die Size 178mm²	Die Size 295mm²
Transistor Count 25 Billion	Transistor Count 40 Billion
Transistor Density 140 MTr/mm²	Transistor Density 136 MTr/mm²

Images

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No images available

Used In

Laptops -	Laptops MacBook Pro 14(M2 Pro, Early 2023)
Desktops -	Desktops Mac mini(M2 Pro, Early 2023)

Competitors

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