AMD Ryzen 9 270 vs Qualcomm Snapdragon X Plus (X1P-42-100) Full Specs

Summary

8 Cores 16 Threads 4GHz	8 Cores 8 Threads 3.2GHz
TDP 45W	TDP 23W
Bandwidth 120GB/s LPDDR5X·DDR5	Bandwidth 135.2GB/s LPDDR5X
iGPU Radeon 780M 2700MHz	iGPU Adreno X1 1.7T
Peak·FP32·FP16 8.29 TFLOPSFP16	Peak·FP32·FP16 3.41 TFLOPSFP16
Socket FP8	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen 9 2702,387

x1.04

Snapdragon X Plus (X1P-42-100)2,288

x1

Show Top Score

Core Config

8 Cores	8 Cores
16 Threads	8 Threads

Clocks

Base Clock 4GHz	Base Clock 3.2GHz
Boost Clock 5.2GHz	Boost Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 192KB
L1d 32KB	L1d 96KB
L2 1MB	L2 24MB shared
L3 16MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5X
Max Memory 256GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 7500MT/s	Speed 8448MT/s
Bandwidth 120GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 45W	TDP 23W
cTDP-down 35W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x20 39.4GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
-	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Radeon 780M 2700MHz	iGPU Adreno X1 1.7T
Shaders 768	Shaders 1024
Boost Clock 2.7GHz	Boost Clock 833MHz
Peak·FP32·FP16 8.29 TFLOPSFP16	Peak·FP32·FP16 3.41 TFLOPSFP16

NPU

NPU Model XDNA	NPU Model Hexagon
Performance 16 TOPSINT4	Performance 45 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Zen 4	Architecture OryonARMv8.7-A
Family Ryzen 200	Family X Series
Branding	Branding
Codename Hawk Point - -	Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Sep 4, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4	Fabrication Node N4P
Die Size 178mm²	Die Size 170mm²
Transistor Count 25 Billion	Transistor Count -
Transistor Density 140 MTr/mm²	Transistor Density -

Images

No images available

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Used In

Laptops -

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)

Competitors

AMDRyzen 9 270 vs CPU AMDRyzen 7 260 AMDRyzen 9 270 vs CPU AMDRyzen 7 250 AMDRyzen 9 270 vs CPU AMDRyzen 7 PRO 250 Show 12 more

QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen 7 260 QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen 7 250 Show 12 more