AMD Ryzen 9 6900HX vs Apple M3 Pro (11C14G) Full Specs

Summary

8 Cores 16 Threads 3.3GHz	11 Cores(5P+6E) 11 Threads(5P+6E) 4.05GHz
TDP 45W	TDP 60W
Bandwidth 204.8GB/s LPDDR5·DDR5	Bandwidth 153.6GB/s LPDDR5
iGPU Radeon 680M 2400MHz	iGPU 14-Core M3 Pro
Peak·FP32·FP16 7.37 TFLOPSFP16	Peak·FP32·FP16 4.95 TFLOPSFP16
Socket FP7	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen 9 6900HX2,146

x1

M3 Pro (11C14G)3,140

x1.46

Show Top Score

Core Config

8 Cores 8P -	11 Cores 5P 6E
16 Threads 16P -	11 Threads 5P 6E

Clocks

Base Clock 3.3GHz	Base Clock 4.05GHz
Boost Clock 4.9GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 128KB P 64KB E
L2 512KB P - -	L2 24MB P shared 4MB E shared
L3 32MB	L3 -
SLC Cache -	SLC Cache 12MB

Memory

Type LPDDR5·DDR5	Type LPDDR5
Max Memory 64GB	Max Memory 36GB
ECC No	ECC No
Channels 4	Channels 3
Bus Width 256-bit	Bus Width 192-bit
Speed 6400MT/s	Speed 6400MT/s
Bandwidth 204.8GB/s	Bandwidth 153.6GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 153.6GB/s

Power & Thermals

TDP 45W	TDP 60W
Max Operating Temp 95°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 8GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x8 15.8GB/sBandwidth

iGPU

iGPU Radeon 680M 2400MHz	iGPU 14-Core M3 Pro
Shaders 768	Shaders 1792
Boost Clock 2.4GHz	Boost Clock 1.38GHz
Peak·FP32·FP16 7.37 TFLOPSFP16	Peak·FP32·FP16 4.95 TFLOPSFP16

NPU

NPU Model -	NPU Model H15 Erebus
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.36GHz
Performance -	Performance 18 TOPSFP16

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 3+	Architecture Apple Silicon 13ARMv8.6-A
Family Ryzen 6000	Family M Series
Branding	Branding
Codename Rembrandt - - -	Codename Lobos M3 ProVariant EverestP-Core Sawtooth E-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 4, 2022	Release Date Oct 30, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node N3B
Die Size 210mm²	Die Size 219mm²
Transistor Count 13.1 Billion	Transistor Count 37 Billion
Transistor Density 62 MTr/mm²	Transistor Density 169 MTr/mm²

Images

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Used In

Laptops Alienware m15(R7 AMD, Early 2022)Blade 14(Early 2022)Alienware m17(R5, Early 2022) Show 2 more

Laptops MacBook Pro 14(M3 Pro, Late 2023)

Competitors

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AppleM3 Pro (11C14G) vs CPU AppleM5 Pro (18C20G) AppleM3 Pro (11C14G) vs CPU AppleM5 Pro (15C16G) AppleM3 Pro (11C14G) vs CPU AppleM4 (10C8G-FL) Show 12 more