CPUs

AMD Ryzen 9 9900X3D vs Intel Xeon W-3225 Full Specs

12 Cores
24 Threads
4.4GHz
8 Cores
16 Threads
3.7GHz
TDP
120W
TDP
160W
Bandwidth
89.6GB/s
DDR5
Bandwidth
128GB/s
DDR4
iGPU
iGPU
-
··
1.13 TFLOPSFP16
··
-
Socket
Socket

Ryzen 9 9900X3DRyzen 9 9900X3D3,421
x2.23
Xeon W-3225Xeon W-32251,531
x1

12 Cores
8 Cores
24 Threads
16 Threads

Base Clock
4.4GHz
Base Clock
3.7GHz
Boost Clock
5.5GHz
Boost Clock
4.4GHz
Overclocking
Unlocked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
48KB
L1d
32KB
L2
1MB
L2
1MB
L3
128MB(V-Cache)
L3
16.5MB

Type
DDR5
Type
DDR4
Max Memory
192GB
Max Memory
1.02TB
ECC
Yes
ECC
Yes
Channels
2
Channels
6
Bus Width
128-bit
Bus Width
384-bit
Speed
5600MT/s
Speed
2666MT/s
Bandwidth
89.6GB/s
Bandwidth
128GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
89.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
128GB/s

TDP
120W
TDP
160W
Max Operating Temp
95°C Max
Max Operating Temp
68°C Max
Included Cooler
0
Included Cooler
-

Bus Type
PCIe
Bus Type
DMI
Bus Config
8 lanes
Bus Config
4 lanes
Bus Speed
32GT/s
Bus Speed
8GT/s
Bus Bandwidth
32GB/s
Bus Bandwidth
4GB/s

PCIe
PCIe 5.0 x24
94.5GB/sBandwidth
PCIe
PCIe 3.0 x64
63GB/sBandwidth

iGPU
iGPU
-
Shaders
128
Shaders
-
Boost Clock
2.2GHz
Boost Clock
-
··
1.13 TFLOPSFP16
··
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 9 2017 branding
Branding
Xeon 2016 branding
Codename
Granite Ridge
EldoraDie
Granite Ridge 2CCD 3DVariant
Codename
Cascade Lake-SP
-
Cascade Lake-SP-LCCVariant
Market Segment
Desktop
Market Segment
Workstation
Release Date
Jan 6, 2025
Release Date
Jun 3, 2019

Foundry
TSMC
Foundry
Intel
Other Foundries
TSMCIO
Other Foundries
-
Fabrication Node
N4X
N6IO
Fabrication Node
14nm++
-
Die Size
141mm²
122mm²IO
Die Size
324mm²
-
Transistor Count
16.6 Billion
3.4 BillionIO
Transistor Count
5.7 Billion
-
Transistor Density
118 MTr/mm²
28 MTr/mm²IO
Transistor Density
18 MTr/mm²
-

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