AMD Ryzen AI 5 340 vs Apple M3 (8C8G-FL) Full Specs

Summary

6 Cores(3P+3E) 12 Threads(6P+6E) 2GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 4.05GHz
TDP 28W	TDP 15W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 102.4GB/s LPDDR5
iGPU Radeon 840M 2900MHz	iGPU 8-Core M3-FL
Peak·FP32·FP16 2.97 TFLOPSFP16	Peak·FP32·FP16 2.74 TFLOPSFP16
Socket FP8	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 5 340-

-

M3 (8C8G-FL)3,130

x1

Show Top Score

Core Config

6 Cores 3P 3E	8 Cores 4P 4E
12 Threads 6P 6E	8 Threads 4P 4E

Clocks

Base Clock 2GHz	Base Clock 4.05GHz
Boost Clock 4.8GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 48KB P -	L1d 128KB P 64KB E
L2 1MB P - -	L2 16MB P shared 4MB E shared
L3 16MB	L3 -
SLC Cache -	SLC Cache 8MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5
Max Memory 256GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 6400MT/s
Bandwidth 128GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s

Power & Thermals

TDP 28W	TDP 15W
cTDP-down 15W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU Radeon 840M 2900MHz	iGPU 8-Core M3-FL
Shaders 256	Shaders 1024
Boost Clock 2.9GHz	Boost Clock 1.34GHz
Peak·FP32·FP16 2.97 TFLOPSFP16	Peak·FP32·FP16 2.74 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model H15 Themis
NPU Cores 32	NPU Cores 16
NPU Clock -	NPU Clock 2.36GHz
Performance 50 TOPSINT8	Performance 18 TOPSFP16

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Apple Silicon 13ARMv8.6-A
Family Ryzen AI 300	Family M Series
Branding	Branding
Codename Strix Point - Zen 5P-Core Zen 5cE-Core	Codename Ibiza M3Variant EverestP-Core Sawtooth E-Core
Market Segment Laptop	Market Segment Tablet
Release Date Jan 6, 2025	Release Date Oct 30, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N3B
Die Size 233mm²	Die Size 153mm²
Transistor Count 28 Billion	Transistor Count 25 Billion
Transistor Density 120 MTr/mm²	Transistor Density 164 MTr/mm²

Images

No images available

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Used In

Laptops Framework 13(Early 2025)

Laptops MacBook Air 13(M3, Early 2024)

Competitors

AMDRyzen AI 5 340 vs CPU AMDRyzen AI 5 PRO 340 AMDRyzen AI 5 340 vs CPU AMDRyzen 5 240 AMDRyzen AI 5 340 vs CPU AMDRyzen AI 7 PRO 350 Show 12 more

AppleM3 (8C8G-FL) vs CPU AppleM4 (10C8G-FL) AppleM3 (8C8G-FL) vs CPU AppleM4 (8C9G-FL) AppleM3 (8C8G-FL) vs CPU AppleM5 (10C10G) Show 12 more