GPUs

AMD Radeon 840M 2900MHz vs Apple 8-Core M3-FL Full Specs

256 Shaders
2.9GHz
1,024 Shaders
1.34GHz
Shared Memory128GB/s
·
Shared Memory102.4GB/sLPDDR5
··
1.49 TFLOPS
··
2.74 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 840M 2900MHzRadeon 840M 2900MHz2.97 TFLOPSFP16
x1.08
8-Core M3-FL8-Core M3-FL2.74 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
··
Peak OPS
2.97 TFLOPSFP16
Peak OPS
2.74 TFLOPSFP16
BF16
2.97 TFLOPS
-
FP32
1.49 TFLOPS
FP32
2.74 TFLOPS
FP64
92.8 GFLOPS
-
Pixel Rate
92.8 GPixel/s
Pixel Rate
42.8 GPixel/s
Texture Rate
46.4 GTexel/s
Texture Rate
85.6 GTexel/s

Shaders
256 Shaders
Shaders
1,024 Shaders
TMUs
16 TMUs
TMUs
64 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
RT Cores
4 RT-Cores
RT Cores
8 RT-Cores
CUs
4 CUs
EUs
128 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.9GHz
Boost Clock
1.34GHz

L2 Cache
-
L2 Cache
2MB shared

Shared Memory
·
Shared MemoryLPDDR5
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
102.4GB/s

Multi-Monitor
4
Multi-Monitor
1
HDCP
HDCP 2.3
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Apple Media Engine 3

Decoder Model
VCN 4.0
Decoder Model
Apple Media Engine 3

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
M3 branding
Codename
Strix Point
Codename
G15G
Market Segment
Laptop
Market Segment
Tablet
Release Date
Jan 6, 2025
Release Date
Oct 30, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N3B
Die Size
233mm²
Die Size
153mm²
Transistor Count
28 Billion
Transistor Count
25 Billion
Transistor Density
120 MTr/mm²
Transistor Density
164 MTr/mm²

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