AMD Ryzen AI 7 350 vs Intel Core i9-11950H Full Specs

Summary

8 Cores(4P+4E) 16 Threads(8P+8E) 2GHz	8 Cores 16 Threads 2.6GHz
TDP 28W	TDP 45W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 51.2GB/s DDR4
iGPU Radeon 860M 3000MHz	iGPU UHD 32EU 1450MHz Gen 12
Peak·FP32·FP16 4.61 TFLOPSFP16	Peak·FP32·FP16 1.49 TFLOPSFP16
Socket FP8	Socket BGA 1787

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 7 350-

-

Core i9-11950H2,042

x1

Show Top Score

Core Config

8 Cores 4P 4E	8 Cores 8P -
16 Threads 8P 8E	16 Threads 16P -

Clocks

Base Clock 2GHz	Base Clock 2.6GHz
Boost Clock 5GHz	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 48KB P	L1d 48KB P
L2 1MB P	L2 1.25MB P
L3 16MB	L3 24MB

Memory

Type LPDDR5X·DDR5	Type DDR4
Max Memory 256GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 3200MT/s
Bandwidth 128GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP 28W	TDP 45W
cTDP-down 15W	cTDP-down 35W
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 8 lanes
Bus Speed 16GT/s	Bus Speed 8GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

iGPU

iGPU Radeon 860M 3000MHz	iGPU UHD 32EU 1450MHz Gen 12
Shaders 384	Shaders 256
Boost Clock 3GHz	Boost Clock 1.45GHz
Peak·FP32·FP16 4.61 TFLOPSFP16	Peak·FP32·FP16 1.49 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model GNA 2.0
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Tiger Lake
Family Ryzen AI 300	Family Core 11th Gen
Branding	Branding
Codename Strix Point - Zen 5P-Core Zen 5cE-Core	Codename Tiger Lake-B Tiger Lake-8CVariant Willow CoveP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date May 11, 2021

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4P	Fabrication Node 10nm SuperFin
Die Size 233mm²	Die Size 190mm²
Transistor Count 28 Billion	Transistor Count 12.3 Billion
Transistor Density 120 MTr/mm²	Transistor Density 65 MTr/mm²

Images

No images available

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Used In

Laptops Framework 13(Early 2025)

Laptops -

Competitors

AMDRyzen AI 7 350 vs CPU AMDRyzen AI 7 PRO 350 AMDRyzen AI 7 350 vs CPU AMDRyzen 9 270 AMDRyzen AI 7 350 vs CPU AMDRyzen 7 260 Show 12 more

IntelCore i9-11950H vs CPU AMDRyzen AI 7 PRO 350 IntelCore i9-11950H vs CPU AMDRyzen AI Max 385 IntelCore i9-11950H vs CPU AMDRyzen AI Max PRO 385 Show 12 more