AMD Ryzen AI 9 365 vs Intel Core Ultra 5 336H Full Specs
10 Cores(4P+6E) 20 Threads(8P+12E) 2GHz | 12 Cores(4P+4M+4E) 12 Threads(4P+4M+4E) 1.9GHz |
TDP 28W | TDP 25W |
Bandwidth 128GB/s · | Bandwidth 136.5GB/s · |
iGPU | iGPU |
·· 8.91 TFLOPSFP16 | ·· 75.37 TFLOPSFP16 |
Socket | Socket |
Ryzen AI 9 3652,790
Core Ultra 5 336H-10 Cores 4P - 6E | 12 Cores 4P 4M 4E |
20 Threads 8P - 12E | 12 Threads 4P 4M 4E |
Base Clock 2GHz | Base Clock 1.9GHz |
Boost Clock 5GHz | Boost Clock 4.6GHz |
Overclocking Locked | Overclocking Locked |
L0i - | L0i 64KB |
L0d - | L0d 48KB |
L1i 32KB P - - | L1i - 64KB M 64KB E |
L1d 48KB P - - | L1d 192KB P 32KB M 32KB E |
L2 1MB P - - | L2 3MB P 4MB M shared 4MB E shared |
L3 24MB | L3 18MB |
Type · | Type · |
Max Memory 256GB | Max Memory 96GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 8000MT/s | Speed 8533MT/s |
Bandwidth 128GB/s | Bandwidth 136.5GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 128GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 136.5GB/s |
TDP 28W | TDP 25W |
cTDP-down 15W | cTDP-down 15W |
cTDP-up 54W | cTDP-up - |
Peak Power - | Peak Power 80W |
Max Operating Temp 100°C Max | Max Operating Temp 100°C Max |
Included Cooler 0 | Included Cooler - |
Bus Type PCIe | Bus Type - |
Bus Config 4 lanes | Bus Config - |
Bus Speed 16GT/s | Bus Speed - |
Bus Bandwidth 8GB/s | Bus Bandwidth - |
PCIe PCIe 4.0 x1631.5GB/sBandwidth | PCIe PCIe 5.0 x1247.3GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x815.8GB/sBandwidth |
iGPU | iGPU |
Shaders 768 | Shaders 512 |
Boost Clock 2.9GHz | Boost Clock 2.3GHz |
·· 8.91 TFLOPSFP16 | ·· 75.37 TFLOPSFP16 |
NPU Model XDNA 2 | NPU Model NPU 5 |
NPU Cores 32 | NPU Cores 3 |
Performance 50 TOPSINT8 | Performance 47 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Strix Point - Zen 5P-Core - Zen 5cE-Core | Codename Panther Lake-H Panther Lake-H-4P-12EVariant Cougar CoveP-Core DarkmontM-Core DarkmontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 2, 2024 | Release Date Jan 5, 2026 |
Foundry TSMC | Foundry Intel |
Other Foundries - | Other Foundries InteliGPU TSMCPCH |
Fabrication Node N4P - - | Fabrication Node Intel 18A Intel 3iGPU N6PCH |
Die Size 233mm² - - | Die Size 114mm² 27mm²iGPU 56mm²PCH |
Transistor Count 28 Billion - | Transistor Count - 12 MillionPCH |
Transistor Density 120 MTr/mm² | Transistor Density - |
No images available
No images available
Laptops | Laptops - |