AMD Ryzen AI 9 365 vs Intel Core Ultra 9 275HX Full Specs
10 Cores(4P+6E) 20 Threads(8P+12E) 2GHz | 24 Cores(8P+16E) 24 Threads(8P+16E) 2.7GHz |
TDP 28W | TDP 55W |
Bandwidth 128GB/s · | Bandwidth 102.4GB/s DDR5 |
iGPU | iGPU |
·· 8.91 TFLOPSFP16 | ·· 3.89 TFLOPSFP16 |
Socket | Socket |
Ryzen AI 9 3652,790
Core Ultra 9 275HX3,04410 Cores 4P 6E | 24 Cores 8P 16E |
20 Threads 8P 12E | 24 Threads 8P 16E |
Base Clock 2GHz | Base Clock 2.7GHz |
Boost Clock 5GHz | Boost Clock 5.4GHz |
Overclocking Locked | Overclocking Unlocked |
L1i 32KB P - | L1i 64KB P 64KB E |
L1d 48KB P - | L1d 48KB P 32KB E |
L2 1MB P - | L2 3MB P 16MB E shared |
L3 24MB | L3 24MB |
Type · | Type DDR5 |
Max Memory 256GB | Max Memory 192GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 8000MT/s | Speed 6400MT/s |
Bandwidth 128GB/s | Bandwidth 102.4GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 128GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 102.4GB/s |
TDP 28W | TDP 55W |
cTDP-down 15W | cTDP-down 45W |
cTDP-up 54W | cTDP-up - |
Peak Power - | Peak Power 160W |
Max Operating Temp 100°C Max | Max Operating Temp 105°C Max |
Included Cooler 0 | Included Cooler - |
Bus Type PCIe | Bus Type DMI |
Bus Config 4 lanes | Bus Config 8 lanes |
Bus Speed 16GT/s | Bus Speed 16GT/s |
Bus Bandwidth 8GB/s | Bus Bandwidth 16GB/s |
PCIe PCIe 4.0 x1631.5GB/sBandwidth | PCIe PCIe 5.0 x2078.8GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth |
iGPU | iGPU |
Shaders 768 | Shaders 512 |
Boost Clock 2.9GHz | Boost Clock 1.9GHz |
·· 8.91 TFLOPSFP16 | ·· 3.89 TFLOPSFP16 |
NPU Model XDNA 2 | NPU Model AI Boost 3 |
NPU Cores 32 | NPU Cores 2 |
Performance 50 TOPSINT8 | Performance 13 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Strix Point - Zen 5P-Core Zen 5cE-Core | Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 2, 2024 | Release Date Jan 6, 2025 |
Foundry TSMC | Foundry TSMC |
Other Foundries - | Other Foundries TSMCiGPU TSMCIO TSMCSoC |
Fabrication Node N4P - - - | Fabrication Node N3B N5iGPU N6IO N6SoC |
Die Size 233mm² - - - | Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC |
Transistor Count 28 Billion | Transistor Count - |
Transistor Density 120 MTr/mm² | Transistor Density - |
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Laptops | Laptops |