AMD Ryzen AI 9 HX 370 vs AMD Ryzen AI Max 390 Full Specs

Summary

12 Cores(4P+8E) 24 Threads(8P+16E) 2GHz	12 Cores 24 Threads 3.2GHz
TDP 28W	TDP 65W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 256GB/s LPDDR5X
iGPU Radeon 890M 2900MHz	iGPU Radeon 8050S
Peak·FP32·FP16 11.88 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16
Socket FP8	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 9 HX 3702,900

x1.02

Ryzen AI Max 3902,835

x1

Show Top Score

Core Config

12 Cores 4P 8E	12 Cores 12P -
24 Threads 8P 16E	24 Threads 24P -

Clocks

Base Clock 2GHz	Base Clock 3.2GHz
Boost Clock 5.1GHz	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 48KB P	L1d 48KB P
L2 1MB P	L2 1MB P
L3 24MB	L3 64MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5X
Max Memory 256GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 8000MT/s	Speed 8000MT/s
Bandwidth 128GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 28W	TDP 65W
cTDP-down 15W	cTDP-down 45W
cTDP-up 54W	cTDP-up 120W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler 0

Chipset Bus

Bus Type PCIe	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Radeon 890M 2900MHz	iGPU Radeon 8050S
Shaders 1024	Shaders 2048
Boost Clock 2.9GHz	Boost Clock 2.8GHz
Peak·FP32·FP16 11.88 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model XDNA 2
NPU Cores 32	NPU Cores 32
Performance 50 TOPSINT8	Performance 50 TOPSINT8

Chip

Manufacturer AMD	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Zen 5
Family Ryzen AI 300	Family Ryzen AI 300
Branding	Branding
Codename Strix Point - Zen 5P-Core Zen 5cE-Core	Codename Strix Halo EldoraDie Zen 5P-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jun 2, 2024	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node N4P -	Fabrication Node N4X N5SoC
Die Size 233mm²	Die Size 141mm²
Transistor Count 28 Billion	Transistor Count 16.6 Billion
Transistor Density 120 MTr/mm²	Transistor Density 118 MTr/mm²

Images

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Used In

Laptops Blade 16(Early 2025)Framework 13(Early 2025)

Laptops -

Competitors

AMDRyzen AI 9 HX 370 vs CPU AMDRyzen AI 7 PRO 350 AMDRyzen AI 9 HX 370 vs CPU AMDRyzen AI 7 350 AMDRyzen AI 9 HX 370 vs CPU AMDRyzen 9 270 Show 12 more

AMDRyzen AI Max 390 vs CPU AMDRyzen AI Max 385 AMDRyzen AI Max 390 vs CPU AMDRyzen AI Max+ 395 AMDRyzen AI Max 390 vs CPU AMDRyzen AI Max PRO 385 Show 12 more