CPUs

AMD Ryzen Z1 vs Sony Emotion Engine R3 Full Specs

6 Cores(2P+4E)
12 Threads(4P+8E)
3.2GHz
1 Cores
2 Threads
300MHz
TDP
15W
TDP
15W
Bandwidth
120GB/s
·
Bandwidth
3.2GB/s
RDRAM
iGPU
iGPU
-
··
2.56 TFLOPSFP16
··
-
Socket
Socket
-

Ryzen Z1Ryzen Z11,995
x1
Emotion Engine R3Emotion Engine R3-
-

6 Cores
2P
4E
1 Cores
1P
-
12 Threads
4P
8E
2 Threads
2P
-

Base Clock
3.2GHz
Base Clock
300MHz
Boost Clock
4.9GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
L1i
16KB P
L1d
32KB P
L1d
8KB P
L2
1MB P
L2
16KB P
L3
16MB
L3
-

Type
·
Type
RDRAM
Max Memory
256GB
Max Memory
32MB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
32-bit
Speed
7500MT/s
Speed
800MT/s
Bandwidth
120GB/s
Bandwidth
3.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
3.2GB/s

TDP
15W
TDP
15W
cTDP-down
9W
cTDP-down
-
cTDP-up
30W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
-
Included Cooler
0
Included Cooler
-

Bus Type
PCIe
Bus Type
FSB
Bus Config
4 lanes
Bus Config
128-bit
Bus Speed
16GT/s
Bus Speed
150MT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
2.4GB/s

PCIe
PCIe 4.0 x14
27.6GB/sBandwidth
-

iGPU
iGPU
-
Shaders
256
Shaders
-
Boost Clock
2.5GHz
Boost Clock
-
··
2.56 TFLOPSFP16
··
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
MIPS III
Architecture
Architecture
Family
Family
-
Branding
Z1 2023 branding
Branding
PlayStation  branding
Codename
Phoenix 2
Zen 4P-Core
Zen 4cE-Core
Codename
EE-3
MIPS R5900P-Core
-
Market Segment
Console
Market Segment
Console
Release Date
May 5, 2023
Release Date
Apr 18, 2001

Foundry
TSMC
Foundry
Sony
Fabrication Node
N4
Fabrication Node
180nm
Die Size
137mm²
Die Size
110mm²
Transistor Count
20.9 Billion
Transistor Count
14 Million
Transistor Density
153 MTr/mm²
Transistor Density
-

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