CPUs

AMD Ryzen Z2 Go vs Sony Emotion Engine GS-8 Full Specs

4 Cores(2P+2E)
8 Threads(4P+4E)
3GHz
1 Cores
2 Threads
300MHz
TDP
28W
TDP
6W
Bandwidth
120GB/s
·
Bandwidth
3.2GB/s
RDRAM
iGPU
iGPU
··
2.87 TFLOPSFP16
··
6.2 GFLOPSFP32
Socket
Socket
-

Ryzen Z2 GoRyzen Z2 Go3.3GHz
x1
Emotion Engine GS-8Emotion Engine GS-8-
-

4 Cores
2P
2E
1 Cores
1P
-
8 Threads
4P
4E
2 Threads
2P
-

Base Clock
3GHz
Base Clock
300MHz
Boost Clock
4.3GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
L1i
16KB P
L1d
32KB P
L1d
8KB P
L2
1MB P
L2
16KB P
L3
16MB
L3
-

Type
·
Type
RDRAM
Max Memory
128GB
Max Memory
32MB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
32-bit
Speed
7500MT/s
Speed
800MT/s
Bandwidth
120GB/s
Bandwidth
3.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
3.2GB/s

TDP
28W
TDP
6W
cTDP-down
15W
cTDP-down
-
cTDP-up
30W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
-
Included Cooler
0
Included Cooler
-

Bus Type
PCIe
Bus Type
FSB
Bus Config
4 lanes
Bus Config
128-bit
Bus Speed
16GT/s
Bus Speed
150MT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
2.4GB/s

PCIe
PCIe 4.0 x14
27.6GB/sBandwidth
-

iGPU
iGPU
Shaders
256
Shaders
16
Boost Clock
2.8GHz
Boost Clock
150MHz
··
2.87 TFLOPSFP16
··
6.2 GFLOPSFP32

Manufacturer
Manufacturer
ISA
x86-64
ISA
MIPS III
Architecture
Architecture
Family
Family
-
Branding
Z2 Go 2024 branding
Branding
PlayStation  branding
Codename
Phoenix 2
Zen 4P-Core
Zen 4cE-Core
Codename
EE-6
MIPS R5900P-Core
-
Market Segment
Console
Market Segment
Console
Release Date
Jan 6, 2025
Release Date
Jul 1, 2007

Foundry
TSMC
Foundry
Sony
Fabrication Node
N4
Fabrication Node
65nm
Die Size
137mm²
Die Size
-
Transistor Count
20.9 Billion
Transistor Count
-
Transistor Density
153 MTr/mm²
Transistor Density
-

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