Apple A6X vs Intel Core m3-7Y30 Full Specs

Summary

2 Cores 2 Threads 1.4GHz	2 Cores 4 Threads 1GHz
TDP 8W	TDP 5W
Bandwidth 17.1GB/s LPDDR2	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU PowerVR SGX554 MP4 A6X	iGPU HD 615 900MHz
Peak·FP32·FP16 76.8 GFLOPSFP32	Peak·FP32·FP16 345.6 GFLOPSFP16
Socket -	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

A6X-

-

Core m3-7Y30777

x1

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Core Config

2 Cores	2 Cores
2 Threads	4 Threads

Clocks

Base Clock 1.4GHz	Base Clock 1GHz
Boost Clock -	Boost Clock 2.6GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 1MB shared	L2 256KB
L3 -	L3 4MB

Memory

Type LPDDR2	Type LPDDR3·DDR3L
Max Memory 1GB	Max Memory 16GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1066MT/s	Speed 1866MT/s
Bandwidth 17.1GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate1066MT/s Calculated Bandwidth 17.1GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 8W	TDP 5W
cTDP-down -	cTDP-down 4W
cTDP-up -	cTDP-up 7W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU PowerVR SGX554 MP4 A6X	iGPU HD 615 900MHz
Shaders 128	Shaders 192
Boost Clock 300MHz	Boost Clock 900MHz
Peak·FP32·FP16 76.8 GFLOPSFP32	Peak·FP32·FP16 345.6 GFLOPSFP16

Controller

Controller Model -	Controller Model 200 Series Y+
Codename -	Codename Kaby Lake
PCIe -	PCIe -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch32	ISA x86-64
Architecture Apple Silicon 1ARMv7s	Architecture Skylake
Family A Series	Family Core 6th Gen
Branding	Branding
Codename Bali-X A6XVariant SwiftP-Core	Codename Kaby Lake-H Kaby Lake-2C-GT2Variant -
Market Segment Tablet	Market Segment Laptop
Release Date Nov 2, 2012	Release Date Jan 3, 2017

Fabrication

Foundry Samsung	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node 32nm -	Fabrication Node 14nm+ 22nmPCH
Die Size 123mm² -	Die Size 103mm² 50mm²PCH
Transistor Count -	Transistor Count 1.8 Billion
Transistor Density -	Transistor Density 17 MTr/mm²

Images

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Used In

Tablets iPad 4(A6X, Late 2012)

Tablets Surface Pro 5(Intel 7th Gen, Mid 2017)

Competitors

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