Apple A8X vs Intel Core m3-6Y30 Full Specs

Summary

3 Cores 3 Threads 1.5GHz	2 Cores 4 Threads 900MHz
TDP 8W	TDP 4.5W
Bandwidth 25.6GB/s LPDDR3	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU PowerVR GX6850 A8X	iGPU HD 515 850MHz
Peak·FP32·FP16 486.4 GFLOPSFP16	Peak·FP32·FP16 326.4 GFLOPSFP32
Socket -	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

A8X447

x1

Core m3-6Y30710

x1.59

Show Top Score

Core Config

3 Cores	2 Cores
3 Threads	4 Threads

Clocks

Base Clock 1.5GHz	Base Clock 900MHz
Boost Clock -	Boost Clock 2.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB	L1i 32KB
L1d 64KB	L1d 32KB
L2 2MB shared	L2 256KB
L3 4MB	L3 4MB

Memory

Type LPDDR3	Type LPDDR3·DDR3L
Max Memory 2GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1600MT/s	Speed 1866MT/s
Bandwidth 25.6GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate1600MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 8W	TDP 4.5W
cTDP-down -	cTDP-down 4W
Max Operating Temp -	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU PowerVR GX6850 A8X	iGPU HD 515 850MHz
Shaders 256	Shaders 192
Boost Clock 475MHz	Boost Clock 850MHz
Peak·FP32·FP16 486.4 GFLOPSFP16	Peak·FP32·FP16 326.4 GFLOPSFP32

Controller

Controller Model -	Controller Model 100 Series Y+
Codename -	Codename Skylake
PCIe -	PCIe -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 3ARMv8.0-A	Architecture Skylake
Family A Series	Family Core 6th Gen
Branding	Branding
Codename Capri A8XVariant TyphoonP-Core	Codename Skylake-H Skylake-2C-GT2Variant -
Market Segment Tablet	Market Segment Laptop
Release Date Oct 22, 2014	Release Date Sep 1, 2015

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node 20nm -	Fabrication Node 14nm 22nmPCH
Die Size 128mm² -	Die Size 102mm² 50mm²PCH
Transistor Count 3 Billion	Transistor Count 1.8 Billion
Transistor Density 23 MTr/mm²	Transistor Density 17 MTr/mm²

Images

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Used In

Tablets iPad Air 2(A8X, Late 2014)

Tablets Surface Pro 4(Intel 6th Gen, Late 2015)

Competitors

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