Apple M2 (8C10G-FL) vs Qualcomm Snapdragon 8 Gen 3 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 3.49GHz	8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.3GHz
TDP 15W	TDP 5W
Bandwidth 102.4GB/s LPDDR5	Bandwidth 76.8GB/s LPDDR5X
iGPU 10-Core M2-FL	iGPU Adreno 750
Peak·FP32·FP16 3.58 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16

Core Config

8 Cores 4P - 4E	8 Cores 1P 5M 2E
8 Threads 4P - 4E	8 Threads 1P 5M 2E

Clocks

Base Clock 3.49GHz	Base Clock 3.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P - 128KB E	L1i 64KB P 64KB M 32KB E
L1d 128KB P - 64KB E	L1d 64KB P 64KB M 32KB E
L2 16MB P shared 4MB E shared	L2 1MB P 512KB M 128KB E - -
L3 -	L3 12MB
SLC Cache 8MB	SLC Cache 4MB

Memory

Type LPDDR5	Type LPDDR5X
Max Memory 24GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 64-bit
Speed 6400MT/s	Speed 9600MT/s
Bandwidth 102.4GB/s	Bandwidth 76.8GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 102.4GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s UC·Spec·OC 76.8GB/s

Power & Thermals

TDP 15W	TDP 5W
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

-

iGPU

iGPU 10-Core M2-FL	iGPU Adreno 750
Shaders 1280	Shaders 1536
Boost Clock 1.4GHz	Boost Clock 900MHz
Peak·FP32·FP16 3.58 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16

NPU

NPU Model H14 Bia	NPU Model Hexagon
NPU Cores 16	NPU Cores -
NPU Clock 2.1GHz	NPU Clock -
Performance 15.8 TOPSFP16	Performance 45 TOPSINT8

Cellular

Modem Model -	Modem Model X75
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 10.0Gbps
Peak Up -	Peak Up Up to 3.5Gbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Apple Silicon 11ARMv8.5-A	Architecture KryoARMv9.0-A
Family M Series	Family 8 Series
Branding	Branding
Codename Staten M2Variant AvalancheP-Core - BlizzardE-Core	Codename - Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core
Market Segment Tablet	Market Segment Smartphone
Release Date Jun 6, 2022	Release Date Oct 24, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N5P	Fabrication Node N4P
Die Size 153mm²	Die Size 137mm²
Transistor Count 20.1 Billion	Transistor Count -
Transistor Density 131 MTr/mm²	Transistor Density -

Images

Used In

Laptops MacBook Air 13(M2, Mid 2022)MacBook Air 15(M2, Mid 2023)	Laptops -
Smartphones -	Smartphones OnePlus 12OnePlus 13R
Tablets iPad Pro 11" Gen 4(M2, Early 2021)iPad Pro 12.9" Gen 6(M2, Early 2021)	Tablets OnePlus Pad 2(SD 8G3, Mid 2024)

Competitors

AppleM2 (8C10G-FL) vs CPU AppleM1 (8C7G-FL) AppleM2 (8C10G-FL) vs CPU AppleM1 (8C8G-FL) AppleM2 (8C10G-FL) vs CPU AppleM3 (8C8G-FL) Show 12 more

QualcommSnapdragon 8 Gen 3 vs CPU QualcommSnapdragon 8s Gen 3 QualcommSnapdragon 8 Gen 3 vs CPU QualcommSnapdragon 8 Gen 3 Galaxy QualcommSnapdragon 8 Gen 3 vs CPU QualcommSnapdragon 8 Elite Show 12 more