Apple M2 Pro (12C19G) vs AMD Ryzen AI Max 390 Full Specs

Summary

12 Cores(8P+4E) 12 Threads(8P+4E) 3.5GHz	12 Cores 24 Threads 3.2GHz
TDP 60W	TDP 65W
Bandwidth 204.8GB/s LPDDR5	Bandwidth 256GB/s LPDDR5X
iGPU 19-Core M2 Pro	iGPU Radeon 8050S
Peak·FP32·FP16 6.8 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16
Socket -	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M2 Pro (12C19G)2,680

x1

Ryzen AI Max 3902,835

x1.06

Show Top Score

Core Config

12 Cores 8P 4E	12 Cores 12P -
12 Threads 8P 4E	24 Threads 24P -

Clocks

Base Clock 3.5GHz	Base Clock 3.2GHz
Boost Clock -	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P -
L1d 128KB P 64KB E	L1d 48KB P -
L2 24MB P shared 4MB E shared	L2 1MB P - -
L3 -	L3 64MB
SLC Cache 24MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR5X
Max Memory 32GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 256-bit	Bus Width 256-bit
Speed 6400MT/s	Speed 8000MT/s
Bandwidth 204.8GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 60W	TDP 65W
cTDP-down -	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type -	Bus Type PCIe
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU 19-Core M2 Pro	iGPU Radeon 8050S
Shaders 2432	Shaders 2048
Boost Clock 1.4GHz	Boost Clock 2.8GHz
Peak·FP32·FP16 6.8 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16

NPU

NPU Model H14 Selene	NPU Model XDNA 2
NPU Cores 16	NPU Cores 32
NPU Clock 2.1GHz	NPU Clock -
Performance 15.8 TOPSFP16	Performance 50 TOPSINT8

Chip

Manufacturer Apple	Manufacturer AMD
ISA AArch64	ISA x86-64
Architecture Apple Silicon 11ARMv8.5-A	Architecture Zen 5
Family M Series	Family Ryzen AI 300
Branding	Branding
Codename Rhodes-Chop - M2 ProVariant AvalancheP-Core BlizzardE-Core	Codename Strix Halo EldoraDie - Zen 5P-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 17, 2023	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node N5P -	Fabrication Node N4X N5SoC
Die Size 295mm²	Die Size 141mm²
Transistor Count 40 Billion	Transistor Count 16.6 Billion
Transistor Density 136 MTr/mm²	Transistor Density 118 MTr/mm²

Images

No images available

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Used In

Laptops MacBook Pro 14(M2 Pro, Early 2023)MacBook Pro 16(M2 Pro, Early 2023)	Laptops -
Desktops Mac mini(M2 Pro, Early 2023)	Desktops -

Competitors

AppleM2 Pro (12C19G) vs CPU AppleM5 Pro (15C16G) AppleM2 Pro (12C19G) vs CPU AppleM5 Pro (18C20G) AppleM2 Pro (12C19G) vs CPU IntelCore Ultra 5 235HX Show 12 more

AMDRyzen AI Max 390 vs CPU AMDRyzen AI Max 385 AMDRyzen AI Max 390 vs CPU AMDRyzen AI Max+ 395 AMDRyzen AI Max 390 vs CPU AMDRyzen AI Max PRO 385 Show 12 more