Apple M4 (8C8G) vs Intel Core i7-11370H Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 4.41GHz	4 Cores 8 Threads 3.3GHz
TDP 30W	TDP 35W
Bandwidth 120GB/s LPDDR5X	Bandwidth 68.3GB/s LPDDR4X·DDR4
iGPU 8-Core M4	iGPU Iris Xe 96EU 1350MHz
Peak·FP32·FP16 3.23 TFLOPSFP16	Peak·FP32·FP16 4.15 TFLOPSFP16
Socket -	Socket BGA 1449

Core Config

8 Cores 4P 4E	4 Cores 4P -
8 Threads 4P 4E	8 Threads 8P -

Clocks

Base Clock 4.41GHz	Base Clock 3.3GHz
Boost Clock -	Boost Clock 4.8GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P -
L1d 128KB P 64KB E	L1d 48KB P -
L2 16MB P shared 4MB E shared	L2 1.25MB P - -
L3 -	L3 12MB
SLC Cache 8MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR4X·DDR4
Max Memory 24GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 7500MT/s	Speed 4266MT/s
Bandwidth 120GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s UC·Spec·OC 120GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s UC·Spec·OC 68.3GB/s

Power & Thermals

TDP 30W	TDP 35W
cTDP-down -	cTDP-down 28W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 4.0 x5 9.8GB/sBandwidth

PCIe PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU 8-Core M4	iGPU Iris Xe 96EU 1350MHz
Shaders 1024	Shaders 768
Boost Clock 1.58GHz	Boost Clock 1.35GHz
Peak·FP32·FP16 3.23 TFLOPSFP16	Peak·FP32·FP16 4.15 TFLOPSFP16

NPU

NPU Model H16 Leto	NPU Model GNA 2.0
NPU Cores 16	NPU Cores -
NPU Clock 2.36GHz	NPU Clock -
Performance 38 TOPSINT8	Performance -

Controller

Controller Model -	Controller Model 500 Series UP3+
Codename -	Codename Tiger Lake
PCIe -	PCIe -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 14ARMv9.2-A	Architecture Tiger Lake
Family M Series	Family Core 11th Gen
Branding	Branding
Codename Donan M4Variant AS14PP-Core AS14EE-Core	Codename Tiger Lake-H35 Tiger Lake-4C-GT3Variant Willow CoveP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Oct 28, 2024	Release Date Jan 11, 2021

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node N3E -	Fabrication Node 10nm SuperFin 14nmPCH
Die Size 169mm² -	Die Size 146mm² 55mm²PCH
Transistor Count 28 Billion	Transistor Count 9.5 Billion
Transistor Density 165 MTr/mm²	Transistor Density 65 MTr/mm²

Images

Used In

Laptops -	Laptops Surface Laptop Studio(Late 2021)Galaxy Book Odyssey(Early 2021)
All-in-Ones iMac 24(M4, Two Ports, Late 2024)	All-in-Ones Surface Studio 2+(Late 2022)

Competitors

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