Apple M5 (9C10G-FL) vs Qualcomm Snapdragon 8 Gen 1 Full Specs

Summary

9 Cores(3P+6E) 9 Threads(3P+6E) 4.46GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3GHz
TDP 15W	TDP 5W
Bandwidth 153.6GB/s LPDDR5X	Bandwidth 51.2GB/s LPDDR5
iGPU 10-Core M5-FL	iGPU Adreno 730
Peak·FP32·FP16 32.32 TOPSINT8 Tensor	Peak·FP32·FP16 3.35 TFLOPSFP16

Core Config

9 Cores 3P - 6E	8 Cores 1P 3M 4E
9 Threads 3P - 6E	8 Threads 1P 3M 4E

Clocks

Base Clock 4.46GHz	Base Clock 3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P - 128KB E	L1i 64KB P 64KB M 32KB E
L1d 128KB P - 64KB E	L1d 64KB P 64KB M 32KB E
L2 1MB P - - 16MB P shared 6MB E shared	L2 1MB P 512KB M 128KB E - -
L3 -	L3 6MB
SLC Cache 8MB	SLC Cache 4MB

Memory

Type LPDDR5X	Type LPDDR5
Max Memory 32GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 64-bit
Speed 9600MT/s	Speed 6400MT/s
Bandwidth 153.6GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate9600MT/s UC·Spec·OC 153.6GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 51.2GB/s

Power & Thermals

TDP 15W	TDP 5W
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 4.0 x5 9.8GB/sBandwidth

-

iGPU

iGPU 10-Core M5-FL	iGPU Adreno 730
Shaders 1280	Shaders 1024
Boost Clock 1.58GHz	Boost Clock 818MHz
Peak·FP32·FP16 32.32 TOPSINT8 Tensor	Peak·FP32·FP16 3.35 TFLOPSFP16

NPU

NPU Model H17 Theia	NPU Model Hexagon
NPU Cores 16	NPU Cores -
NPU Clock 2.45GHz	NPU Clock -
Performance 38 TOPSINT8	Performance 52 TOPSINT4

Cellular

Modem Model -	Modem Model X65
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 10.0Gbps
Peak Up -	Peak Up Up to 3.0Gbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Apple Silicon 15ARMv9.2-A	Architecture KryoARMv9.0-A
Family M Series	Family 8 Series
Branding	Branding
Codename Hidra M5Variant AS15PP-Core - AS15EE-Core	Codename - Snapdragon 8 Gen 1Variant Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core
Market Segment Tablet	Market Segment Smartphone
Release Date Oct 15, 2025	Release Date Oct 5, 2021

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3P	Fabrication Node 4LPE
Die Size -	Die Size 129mm²

Images

Used In

Smartphones -	Smartphones Galaxy S22Galaxy S22+Galaxy S22 Ultra Show 2 more
Tablets iPad Pro 11" Gen 6(M5, Late 2025)iPad Pro 13" Gen 8(M5, Late 2025)	Tablets Galaxy Tab S8(SD 8G1, Early 2022)Galaxy Tab S8+(SD 8G1, Early 2022)Galaxy Tab S8 Ultra(SD 8G1, Early 2022)

Competitors

AppleM5 (9C10G-FL) vs CPU AppleM4 (8C9G-FL) AppleM5 (9C10G-FL) vs CPU AppleM4 (10C8G-FL) AppleM5 (9C10G-FL) vs CPU AppleM4 (9C10G-FL) Show 12 more

QualcommSnapdragon 8 Gen 1 vs CPU QualcommSnapdragon 888+ QualcommSnapdragon 8 Gen 1 vs CPU QualcommSnapdragon 8+ Gen 1 QualcommSnapdragon 8 Gen 1 vs CPU QualcommSnapdragon 860 Show 12 more