CPUs

Apple M5 (9C10G-FL) vs Qualcomm Snapdragon 8 Gen 3 Full Specs

9 Cores(3P+6E)
9 Threads(3P+6E)
4.46GHz
8 Cores(1P+5M+2E)
8 Threads(1P+5M+2E)
3.3GHz
TDP
15W
TDP
5W
Bandwidth
153.6GB/s
LPDDR5X
Bandwidth
76.8GB/s
LPDDR5X
iGPU
iGPU
··
32.32 TOPSINT8 Tensor
··
5.53 TFLOPSFP16

9 Cores
3P
-
6E
8 Cores
1P
5M
2E
9 Threads
3P
-
6E
8 Threads
1P
5M
2E

Base Clock
4.46GHz
Base Clock
3.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
-
128KB E
L1i
64KB P
64KB M
32KB E
L1d
128KB P
-
64KB E
L1d
64KB P
64KB M
32KB E
L2
1MB P
-
-
16MB P shared
6MB E shared
L2
1MB P
512KB M
128KB E
-
-
L3
-
L3
12MB
SLC Cache
8MB
SLC Cache
4MB

Type
LPDDR5X
Type
LPDDR5X
Max Memory
32GB
Max Memory
24GB
ECC
No
ECC
No
Channels
2
Channels
4
Bus Width
128-bit
Bus Width
64-bit
Speed
9600MT/s
Speed
9600MT/s
Bandwidth
153.6GB/s
Bandwidth
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
153.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
76.8GB/s

TDP
15W
TDP
5W
Max Operating Temp
100°C Max
Max Operating Temp
-

PCIe
PCIe 4.0 x5
9.8GB/sBandwidth
-

iGPU
iGPU
Shaders
1280
Shaders
1536
Boost Clock
1.58GHz
Boost Clock
900MHz
··
32.32 TOPSINT8 Tensor
··
5.53 TFLOPSFP16

NPU Model
H17 Theia
NPU Model
Hexagon
NPU Cores
16
NPU Cores
-
NPU Clock
2.45GHz
NPU Clock
-
Performance
38 TOPSINT8
Performance
45 TOPSINT8

Modem Model
-
Modem Model
X75
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 10.0Gbps
Peak Up
-
Peak Up
Up to 3.5Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv9.0-A
Family
Family
Branding
M5  branding
Branding
Snapdragon 8 Gen 3  branding
Codename
Hidra
M5Variant
AS15PP-Core
-
AS15EE-Core
Codename
-
Snapdragon 8 Gen 3Variant
Cortex-X4P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Market Segment
Tablet
Market Segment
Smartphone
Release Date
Oct 15, 2025
Release Date
Oct 24, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3P
Fabrication Node
N4P
Die Size
-
Die Size
137mm²