HiSilicon Kirin 620 vs Qualcomm Snapdragon 415 Full Specs

Summary

8 Cores 8 Threads 1.2GHz	8 Cores 8 Threads 1.4GHz
TDP 5W	TDP 5W
Bandwidth 6.4GB/s LPDDR3	Bandwidth 5.3GB/s LPDDR3
iGPU Mali-450 MP4 500MHz	iGPU Adreno 405
Peak·FP32·FP16 16 GFLOPSFP32	Peak·FP32·FP16 105.6 GFLOPSFP16

Core Config

8 Cores	8 Cores
8 Threads	8 Threads

Clocks

Base Clock 1.2GHz	Base Clock 1.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 16KB	L1i 32KB
L1d 16KB	L1d 32KB
L2 2MB shared	L2 2MB shared

Memory

Type LPDDR3	Type LPDDR3
Max Memory -	Max Memory 8GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 32-bit	Bus Width 32-bit
Speed 1600MT/s	Speed 1334MT/s
Bandwidth 6.4GB/s	Bandwidth 5.3GB/s
Bandwidth Calculator Channels Transfer Rate1600MT/s UC·Spec·OC 6.4GB/s	Bandwidth Calculator Channels Transfer Rate1334MT/s UC·Spec·OC 5.3GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Mali-450 MP4 500MHz	iGPU Adreno 405
Shaders 16	Shaders 48
Boost Clock 500MHz	Boost Clock 550MHz
Peak·FP32·FP16 16 GFLOPSFP32	Peak·FP32·FP16 105.6 GFLOPSFP16

NPU

NPU Model -

NPU Model Hexagon V50

Cellular

Modem Model Balong 710	Modem Model X5
Peak Down Up to 150Mbps	Peak Down Up to 150Mbps
Peak Up Up to 50Mbps	Peak Up Up to 50Mbps

Chip

Manufacturer HiSilicon	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture ARMv8.0-A	Architecture ARMv8.0-A
Family -	Family 4 Series
Branding	Branding
Codename Cortex-A53P-Core	Codename Cortex-A53P-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Feb 1, 2015	Release Date Jul 1, 2015

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 28nm LP	Fabrication Node 28nm LP

Images

Competitors

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