CPUs

HiSilicon Kirin 620 vs Qualcomm Snapdragon 808+ Full Specs

8 Cores
8 Threads
1.2GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
2GHz
TDP
5W
TDP
5W
Bandwidth
6.4GB/s
LPDDR3
Bandwidth
25.6GB/s
LPDDR4
iGPU
iGPU
··
16 GFLOPSFP32
··
483.8 GFLOPSFP16

8 Cores
8P
-
8 Cores
4P
4E
8 Threads
8P
-
8 Threads
4P
4E

Base Clock
1.2GHz
Base Clock
2GHz
Overclocking
Locked
Overclocking
Locked

L1i
16KB P
-
L1i
32KB P
16KB E
L1d
16KB P
-
L1d
32KB P
16KB E
L2
2MB P shared
-
L2
512KB P shared
1MB E shared

Type
LPDDR3
Type
LPDDR4
Max Memory
-
Max Memory
8GB
ECC
No
ECC
No
Channels
1
Channels
2
Bus Width
32-bit
Bus Width
64-bit
Speed
1600MT/s
Speed
3200MT/s
Bandwidth
6.4GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
6.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
25.6GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
16
Shaders
192
Boost Clock
500MHz
Boost Clock
630MHz
··
16 GFLOPSFP32
··
483.8 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon V56
NPU Clock
-
NPU Clock
800MHz

Modem Model
Balong 710
Modem Model
X10
Peak Down
Up to 150Mbps
Peak Down
Up to 450Mbps
Peak Up
Up to 50Mbps
Peak Up
Up to 50Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon 8 Series  branding
Codename
Cortex-A53P-Core
-
Codename
Cortex-A57P-Core
Cortex-A53E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Feb 1, 2015
Release Date
Jul 1, 2015

Foundry
Samsung
Foundry
Samsung
Fabrication Node
28nm LP
Fabrication Node
28nm LP