HiSilicon Kirin 650 vs Qualcomm Snapdragon 435 Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz | 8 Cores 8 Threads 1.4GHz |
TDP 5W | TDP 5W |
Bandwidth 14.9GB/s LPDDR3 | Bandwidth 6.4GB/s LPDDR3 |
iGPU | iGPU |
·· 36 GFLOPSFP32 | ·· 86.4 GFLOPSFP16 |
8 Cores 4P 4E | 8 Cores 8P - |
8 Threads 4P 4E | 8 Threads 8P - |
Base Clock 2GHz | Base Clock 1.4GHz |
Overclocking Locked | Overclocking Locked |
L1i 16KB P 16KB E | L1i 32KB P - |
L1d 16KB P 16KB E | L1d 32KB P - |
L2 128KB E 1MB P shared | L2 2MB P shared |
Type LPDDR3 | Type LPDDR3 |
Max Memory - | Max Memory 8GB |
ECC No | ECC No |
Channels 2 | Channels 1 |
Bus Width 64-bit | Bus Width 32-bit |
Speed 1866MT/s | Speed 1600MT/s |
Bandwidth 14.9GB/s | Bandwidth 6.4GB/s |
Bandwidth Calculator Channels Transfer Rate ·· | Bandwidth Calculator Channels Transfer Rate ·· |
TDP 5W | TDP 5W |
iGPU | iGPU |
Shaders 20 | Shaders 48 |
Boost Clock 900MHz | Boost Clock 450MHz |
·· 36 GFLOPSFP32 | ·· 86.4 GFLOPSFP16 |
NPU Model - | NPU Model Hexagon 536 |
Modem Model Balong 720 | Modem Model X9 |
Peak Down Up to 300Mbps | Peak Down Up to 300Mbps |
Peak Up Up to 50Mbps | Peak Up Up to 150Mbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture | Architecture |
Family - | Family |
Branding  | Branding  |
Codename Cortex-A53P-Core Cortex-A53E-Core | Codename Cortex-A53P-Core - |
Market Segment Smartphone | Market Segment Smartphone |
Release Date May 1, 2016 | Release Date Oct 12, 2016 |
Foundry Samsung | Foundry Samsung |
Fabrication Node 28nm LP | Fabrication Node 28nm LP |
